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research-article

Adhesive bond imaging by noncontact measurements with single-sided access

[+] Author and Article Information
Shogo Nakao

Graduate School of Engineering, Kyoto University, Kyotodaigaku-katsura, Nishikyo-ku, Kyoto 615-8540, Japan
nakao.shogo.24w@st.kyoto-u.ac.jp

Takahiro Hayashi

Graduate School of Engineering, Kyoto University, Kyotodaigaku-katsura, Nishikyo-ku, Kyoto 615-8540, Japan
hayashi@kuaero.kyoto-u.ac.jp

1Corresponding author.

ASME doi:10.1115/1.4039229 History: Received October 23, 2017; Revised January 14, 2018

Abstract

Adhesive bonding, an effective joining technique for plate-like structures in aircraft and automobiles, requires post-bond inspection preferably with noncontact and single-sided access. The present study discusses the application of an imaging technique with a scanning laser source (SLS) to evaluate adhesive bonds in a plate-like structure. When a laser doppler vibrometer is used as a receiver, the SLS technique realizes noncontact measurements with single-sided access. The imaging experiments that used narrowband burst waves and broadband chirp waves indicated that the imaging technique is appropriately applied to adhesive bonds and that the use of broadband chirp waves provides clearer images and reduces spurious images due to resonance. Furthermore, images of adhesive bonds were clearly obtained for a complex plate-structure that consisted of a top-hat section and a flat plate, and this demonstrates that the imaging technique can be widely applied to evaluate various adhesive bonds.

Copyright (c) 2018 by ASME
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