Research Papers

Adhesive Bond Imaging by Noncontact Measurements With Single-Sided Access

[+] Author and Article Information
Shogo Nakao

Graduate School of Engineering,
Kyoto University,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: nakao.shogo.24w@st.kyoto-u.ac.jp

Takahiro Hayashi

Graduate School of Engineering,
Kyoto University,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: hayashi@kuaero.kyoto-u.ac.jp

1Corresponding author.

Manuscript received October 23, 2017; final manuscript received January 14, 2018; published online February 23, 2018. Assoc. Editor: Hoon Sohn.

ASME J Nondestructive Evaluation 1(2), 021009 (Feb 23, 2018) (5 pages) Paper No: NDE-17-1098; doi: 10.1115/1.4039229 History: Received October 23, 2017; Revised January 14, 2018

Adhesive bonding, an effective joining technique for platelike structures in aircraft and automobiles, requires postbond inspection preferably with noncontact and single-sided access. The present study discusses the application of an imaging technique with a scanning laser source (SLS) to evaluate adhesive bonds in a platelike structure. When a laser Doppler vibrometer (LDV) is used as a receiver, the SLS technique realizes noncontact measurements with single-sided access. The imaging experiments that used narrowband burst waves and broadband chirp waves indicated that the imaging technique is appropriately applied to adhesive bonds and that the use of broadband chirp waves provides clearer images and reduces spurious images due to resonance. Furthermore, images of adhesive bonds were clearly obtained for a complex plate structure that consisted of a top-hat section and a flat plate, and this demonstrates that the imaging technique can be widely applied to evaluate various adhesive bonds.

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Fig. 1

Experimental setup

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Fig. 2

Modulation signals for controlling laser output: (a) rectangular burst waves used in the experiments in Sec. 3 and (b) chirp wave varies linearly from 30 kHz to 40 kHz as used in the experiments in Sec. 4. Period and pulse width of the rectangular waves are modified to schematically describe frequency change.

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Fig. 3

Test plate used in the experiments

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Fig. 4

Typical waveform and its frequency spectrum while using narrowband burst waves at three frequencies: (a) waveform and (b) frequency spectrum

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Fig. 5

Images of the bonded region by SLS given the use of frequency spectrum peaks of narrowband burst waves: (a) 30 kHz, (b) 35 kHz, (c) 40 kHz, and (d) average

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Fig. 6

Typical waveform and its frequency spectrum while using chirp modulation signals: (a) waveform and (b) frequency spectrum

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Fig. 7

Image of bonded regions by SLS given the use of chirp modulation signals

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Fig. 8

Schematic figure of the test plate structure with adhesive bonds

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Fig. 9

Images of bonded regions using FIA by narrowband burst waves: (a) left area and (b) right area

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Fig. 10

Images of bonded regions using chirp wave: (a) left area and (b) right area




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