Molecular dynamics simulations are used to investigate the subcritical and supercritical evaporation of a Lennard-Jones (LJ) argon nanodroplet in its own vapor. Using a new technique to control both the ambient temperature and pressure, a range of conditions are considered to define a transition line between subcritical and supercritical evaporation. The evaporation is considered to be supercritical if the surface temperature of the droplet reaches the LJ argon critical temperature during its lifetime. Between ambient temperatures of 300 K and 800 K, the transition from subcritical to supercritical evaporation is observed to occur at an ambient pressure 1.4 times greater than the LJ argon critical pressure. For subcritical conditions, the droplet lifetimes obtained from the simulations are compared to independently predicted lifetimes from the D2 law.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4274-6
PROCEEDINGS PAPER
Subcritical and Supercritical Nanodroplet Evaporation: A Molecular Dynamics Investigation
S. Mikkilineni,
S. Mikkilineni
Carnegie Mellon University, Pittsburg, PA
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E. S. Landry,
E. S. Landry
Carnegie Mellon University, Pittsburg, PA
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A. J. H. McGaughey
A. J. H. McGaughey
Carnegie Mellon University, Pittsburg, PA
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S. Mikkilineni
Carnegie Mellon University, Pittsburg, PA
E. S. Landry
Carnegie Mellon University, Pittsburg, PA
A. J. H. McGaughey
Carnegie Mellon University, Pittsburg, PA
Paper No:
HT2007-32418, pp. 775-782; 8 pages
Published Online:
August 24, 2009
Citation
Mikkilineni, S, Landry, ES, & McGaughey, AJH. "Subcritical and Supercritical Nanodroplet Evaporation: A Molecular Dynamics Investigation." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 775-782. ASME. https://doi.org/10.1115/HT2007-32418
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