A microchannel chassis was specifically designed for conduction-cooled 6U CPU boards. Numerical simulations and experiments were performed on an aluminum microchannel chassis with single phase solution of 50% (by volume) ethylene glycol and deionized water. Thermal and CFD analyses were carried out for 440μm and 900μm and 3mm channel widths using commercial software ANSYS Icepak®. Thermal simulation results were seen to agree fairly well with the experimental data. Thermal testing was done on a 440 μm microchannel chassis manufactured with vacuum brazing. CPU heat flux as high as 30 W/cm2 was tested with coolant flow rates from 0.6 lpm to 1.5 lpm. The heat gained from the chassis was rejected to an air cooled thermal control unit. Experimental results show that CPU junction temperature was 29.6°C higher than the coolant inlet temperature when the flow rate was 0.6 lpm and the chassis pressure drop was 0.22 bar. It was demonstrated that CPU heat flux as high as 30 W/cm2 could be thermally managed with the developed microchannel chassis at 71°C extreme coolant inlet temperature.

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