1-20 of 50
Semiconductor wafers
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

An Radio Frequency Impedance Matching Control Benchmark System for Advanced Control Strategies Evaluation

Carlos A. Rodríguez, Jairo Viola, YangQuan Chen
Proc. ASME. IDETC-CIE2021, Volume 7: 17th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA), V007T07A004, August 17–19, 2021
Paper No: DETC2021-70211
DOI: https://doi.org/10.1115/DETC2021-70211
View Paper
PDF
Topics: Adaptive control, Algorithms, Control equipment, Control systems, Feedback, Feedforward control, Plasmas (Ionized gases), Reflectance, Robustness, Semiconductor wafers
Proceedings Papers

Simulation of Submicron Particle Deposition in Laminar and Turbulent Stagnation Point Flows

Salem Abuzeid, Ahmed A. Busnaina
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 565-574, August 18–22, 1991
Paper No: CIE1991-0070
DOI: https://doi.org/10.1115/CIE1991-0070
View Paper
PDF
Topics: Particulate matter, Simulation, Stagnation flow, Turbulence, Brownian motion, Aerosols, Flow (Dynamics), Fluctuations (Physics), Fluids, Semiconductor wafers
Proceedings Papers

Design and Fabrication of Microelectromechanical Systems

G. K. Ananthasuresh, Sridhar Kota, Selden B. Crary, Kensall D. Wise
Proc. ASME. DETC92, 22nd Biennial Mechanisms Conference: Robotics, Spatial Mechanisms, and Mechanical Systems, 251-258, September 13–16, 1992
Paper No: DETC1992-0222
DOI: https://doi.org/10.1115/DETC1992-0222
View Paper
PDF
Topics: Design, Manufacturing, Microelectromechanical systems, Blocks (Building materials), Micromachining, Micromechanical devices, Sensors, Boron, Circuits, Dimensions
Proceedings Papers

Particle Transport in CVD and Diffusion Processes

Ahmed Busnaina, Xiaoying Zhu, Xiaowei Zheng
Proc. ASME. CIE92, ASME 1992 International Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computers in Fluid Mechanics/Thermal Systems, 483-490, August 2–6, 1992
Paper No: CIE1992-0057
DOI: https://doi.org/10.1115/CIE1992-0057
View Paper
PDF
Topics: Chemical vapor deposition, Diffusion processes, Particulate matter, Furnaces, Semiconductor wafers, Aerosols, Diffusion (Physics), Turbulence, Brownian motion, Computation
Proceedings Papers

Active Vibration Control of Flexible Space Structures by Using Piezoelectric Sensors and Actuators

Brij N. Agrawal, Hyochoong Bang
Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration and Control of Mechanical Systems, 169-179, September 19–22, 1993
Paper No: DETC1993-0232
DOI: https://doi.org/10.1115/DETC1993-0232
View Paper
PDF
Topics: Actuators, Sensors, Space frame structures, Vibration control, Damping, Feedback, Flexible structures, Navy, Piezoelectric actuators, Piezoelectric ceramics
Proceedings Papers

Mass Transport and Particle Transport in an LPCVD Process

Bruce S. MacGibbon, Ahmed A. Busnaina
Proc. ASME. CIE93, 13th Computers in Engineering Conference, 213-219, August 8–12, 1993
Paper No: CIE1993-0027
DOI: https://doi.org/10.1115/CIE1993-0027
View Paper
PDF
Topics: Particulate matter, Contamination, Pressure, Brownian motion, Chemical vapor deposition, Circuits, Dimensions, Drag (Fluid dynamics), Flow (Dynamics), Gravity (Force)
Proceedings Papers

Multiple-Mode Input Shaping Sequences for Reducing Residual Vibrations

B. Whitney Rappole, Jr., Neil C. Singer, Warren P. Seering
Proc. ASME. DETC94, 23rd Biennial Mechanisms Conference: Machine Elements and Machine Dynamics, 11-16, September 11–14, 1994
Paper No: DETC1994-0237
DOI: https://doi.org/10.1115/DETC1994-0237
View Paper
PDF
Topics: Vibration, Feedforward control, Flexible structures, Optimization, Robots, Semiconductor wafers
Proceedings Papers

Design Considerations for Manufacturability of MEMS Comb Actuators

Hrishikesh Dixit, Dean L. Taylor, Srikanth Kannapan
Proc. ASME. DETC-CIE96, Volume 1: Design for Manufacturing Conference, V001T01A047, August 18–22, 1996
Paper No: 96-DETC/DFM-1311
DOI: https://doi.org/10.1115/96-DETC/DFM-1311
View Paper
PDF
Topics: Actuators, Design, Design for Manufacturing, Microelectromechanical systems, Manufacturing, Parametric design, Chemical vapor deposition, Etching, Integrated circuits, Lithography
Proceedings Papers

Removal of Submicron Particles Using High Frequency Ultrasonics

Ahmed A. Busnaina, Fen Dai
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A018, August 18–22, 1996
Paper No: 96-DETC/CIE-1352
DOI: https://doi.org/10.1115/96-DETC/CIE-1352
View Paper
PDF
Topics: Particulate matter, Ultrasonics, Ultrasonic cleaning, Contamination, Chemical vapor deposition, Integrated circuit fabrication, Reactive-ion etching, Semiconductor wafers, Semiconductors (Materials)
Proceedings Papers

Multivariable Feedback Relevant System Identification of a Wafer Stepper System

Raymond A. de Callafon, Paul M. J. Van den Hof
Proc. ASME. DETC97, Volume 1A: 16th Biennial Conference on Mechanical Vibration and Noise, V01AT03A014, September 14–17, 1997
Paper No: DETC97/VIB-4243
DOI: https://doi.org/10.1115/DETC97/VIB-4243
View Paper
PDF
Topics: Feedback, Wafer steppers, Semiconductor wafers, Control equipment, Design, Manufacturing, Robust control
Proceedings Papers

Analytical Modeling for Semiconductor Wafer Fab Environments in Support of Drum-Buffer-Rope Implementation

Jay Maguire, Jim Hinchman, Steve Luce
Proc. ASME. DETC98, Volume 4: 3rd Design for Manufacturing Conference, V004T04A045, September 13–16, 1998
Paper No: DETC98/DFM-5751
DOI: https://doi.org/10.1115/DETC98/DFM-5751
View Paper
PDF
Topics: Design for Manufacturing, Modeling, Polishing equipment, Ropes, Semiconductor wafers, Manufacturing, Cycles, Equipment performance, Industrial capacity
Proceedings Papers

Slurry Residue Removal in Post Chemical Mechanical Polishing

Ahmed A. Busnaina, Naim Moumen
Proc. ASME. DETC99, Volume 2: 19th Computers and Information in Engineering Conference, 87-92, September 12–16, 1999
Paper No: DETC99/CIE-9049
DOI: https://doi.org/10.1115/DETC99/CIE-9049
View Paper
PDF
Topics: Chemical vapor deposition, Contamination, Oxidation, Particulate matter, Polishing, Semiconductor wafers, Slurries
Proceedings Papers

Microfabrication and Characterization of Electro-Thermal-Compliant Micro Devices

Jun Li, G. K. Ananthasuresh
Proc. ASME. IDETC-CIE2000, Volume 7A: 26th Biennial Mechanisms and Robotics Conference, 621-633, September 10–13, 2000
Paper No: DETC2000/MECH-14118
DOI: https://doi.org/10.1115/DETC2000/MECH-14118
View Paper
PDF
Topics: Actuators, Compliant mechanisms, Excimer lasers, Heating, Joules, Materials properties, Metals, Microelectromechanical systems, Microfabrication, Micromachining
Proceedings Papers

Designing a Requirement Driven Product Development Process

Qi Dong, Daniel E. Whitney
Proc. ASME. IDETC-CIE2001, Volume 4: 13th International Conference on Design Theory and Methodology, 11-20, September 9–12, 2001
Paper No: DETC2001/DTM-21682
DOI: https://doi.org/10.1115/DETC2001/DTM-21682
View Paper
PDF
Topics: Design, Product development, Algorithms, Flow (Dynamics), Semiconductor wafers, Systems analysis
Proceedings Papers

Effect of Piezoceramic Hysteresis in Passive and Hybrid Structural Acoustic Control

M. Bulent Ozer, Thomas J. Royston
Proc. ASME. IDETC-CIE2001, Volume 6B: 18th Biennial Conference on Mechanical Vibration and Noise, 1379-1388, September 9–12, 2001
Paper No: DETC2001/VIB-21465
DOI: https://doi.org/10.1115/DETC2001/VIB-21465
View Paper
PDF
Topics: Acoustics, Piezoelectric ceramics, Semiconductor wafers, Dimensions, Equations of motion, Modeling
Proceedings Papers

Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton

Vishnu Aishwaryan Subra Mani, Nathaniel Goldfarb, Gregory S. Fischer
Proc. ASME. IDETC-CIE2020, Volume 9: 40th Computers and Information in Engineering Conference (CIE), V009T09A035, August 17–19, 2020
Paper No: DETC2020-22444
DOI: https://doi.org/10.1115/DETC2020-22444
View Paper
PDF
Topics: Brakes, Design, Exoskeleton devices, Knee, Springs, Robotics, Automotive brakes, Biomechanics, Biomedicine, Performance
Proceedings Papers

Direct Label Free Detection of Orchid Virus Using a Micro/Nano Hybrid Structured Biosensor

Wei-Jhen Wang, Chia-Hwa Lee, Chin-Wen Li, Stephen Liao, Fuh-Jyh Jan, Gou-Jen Wang
Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A002, August 18–21, 2019
Paper No: DETC2019-97198
DOI: https://doi.org/10.1115/DETC2019-97198
View Paper
PDF
Topics: Biosensors, Electrochemical impedance spectroscopy, Electrodes, Ethyl compounds, Integrated circuit fabrication, Self-assembly, Semiconductor wafers, Sensors
Proceedings Papers

Genetically Modified Soybean Detection Using a Biosensor Electrode With Self-Assembled Gold Nanoparticles on a Micro Hemisphere Array

Ying-Ting Lin, Iren Kuznetsova, Gou-Jen Wang
Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A001, August 18–21, 2019
Paper No: DETC2019-97112
DOI: https://doi.org/10.1115/DETC2019-97112
View Paper
PDF
Topics: Biosensors, Electrodes, Nanoparticles, Self-assembly, Semiconductor wafers, Electrochemical impedance spectroscopy, Ethanol, Genetically engineered foods, Photolithography
Proceedings Papers

Tension-Induced Raman Spectrum Enhanced Phenomena of Graphene Membrane

Kai-Ming Hu, Bo Peng, Han Yan, Wen-Ming Zhang, Zhong-Yin Xue, Zeng-Feng Di, Ya-Ting Sun
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A016, August 26–29, 2018
Paper No: DETC2018-85158
DOI: https://doi.org/10.1115/DETC2018-85158
View Paper
PDF
Topics: Graphene, Membranes, Raman spectra, Tension, Silicon-on-insulator, Microfabrication, Microscale devices, Semiconductor wafers, Stress
Proceedings Papers

Characterization of a Non-Interdigitated Comb Drive

Mary Gopanchuk, Mohamed Arabi, N. Nelson-Fitzpatrick, Majed S. Al-Ghamdi, Eihab Abdel-Rahman, Mustafa Yavuz
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A013, August 26–29, 2018
Paper No: DETC2018-86271
DOI: https://doi.org/10.1115/DETC2018-86271
View Paper
PDF
Topics: Actuators, Design, Manufacturing, Semiconductor wafers, Sensors, Silicon-on-insulator