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Proceedings Papers

Design, Modeling, and Optimization of a Novel Asymmetrical Piezoelectrically Actuated Microgripper

Zekui Lyu, Qingsong Xu
Proc. ASME. IDETC-CIE2021, Volume 7: 17th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA), V007T07A039, August 17–19, 2021
Paper No: DETC2021-68787
DOI: https://doi.org/10.1115/DETC2021-68787
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Topics: Design, Modeling, Optimization, Displacement, Grippers, Resonance, Biomedicine, Bridges (Structures), Clamps (Tools), End effectors
Proceedings Papers

Design Methodologies for Computer Architecture Specifications

Jo Dale Carothers
Proc. ASME. DETC91, 3rd International Conference on Design Theory and Methodology, 291-294, September 22–25, 1991
Paper No: DETC1991-0062
DOI: https://doi.org/10.1115/DETC1991-0062
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Topics: Computers, Design, Computer-aided design, Architecture, Design theory, Engineering disciplines, Semiconductors (Materials), Tradeoffs
Proceedings Papers

Minkowski Sums: A Simulation Tool for CAD/CAM

Anil Kaul
Proc. ASME. CIE92, ASME 1992 International Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computers in Fluid Mechanics/Thermal Systems, 447-456, August 2–6, 1992
Paper No: CIE1992-0053
DOI: https://doi.org/10.1115/CIE1992-0053
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Topics: Computer-aided design, Simulation, Algorithms, Path planning, Algebra, Computation, Etching, Interpolation, Process simulation, Robots
Proceedings Papers

Automated Design Tool for Examining Microelectronic Packaging Design Alternatives

Siew-Wei Chin, Subramaniam D. Rajan, Ben K. Nagaraj, Mali Mahalingam
Proc. ASME. DETC93, 10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention, 263-276, September 19–22, 1993
Paper No: DETC1993-0080
DOI: https://doi.org/10.1115/DETC1993-0080
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Topics: Design, Microelectronic packaging, Engineering disciplines, Finite element analysis, Nonlinear programming, Optimization, Packaging, Reliability, Semiconductors (Materials)
Proceedings Papers

A Design Environment for the Design of Micromachines

Ralf Huber, Hans Grabowski, Takashi Kiriyama, Sigeru Yoneda, Aylmer Johnson, Stuart Burgess
Proc. ASME. DETC95, Volume 2: 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention; 7th International Conference on Design Theory and Methodology; JSME Symposium on Design and Production; Mechanical Design Education and History; Computer-Integrated Concurrent Design Conference, 649-661, September 17–20, 1995
Paper No: DETC1995-0199
DOI: https://doi.org/10.1115/DETC1995-0199
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Topics: Design, Actuators, Biomedicine, Conceptual design, Electronic components, Semiconductors (Materials), Sensors
Proceedings Papers

Removal of Submicron Particles Using High Frequency Ultrasonics

Ahmed A. Busnaina, Fen Dai
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A018, August 18–22, 1996
Paper No: 96-DETC/CIE-1352
DOI: https://doi.org/10.1115/96-DETC/CIE-1352
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Topics: Particulate matter, Ultrasonics, Ultrasonic cleaning, Contamination, Chemical vapor deposition, Integrated circuit fabrication, Reactive-ion etching, Semiconductor wafers, Semiconductors (Materials)
Proceedings Papers

Modeling of Particulate Contamination in Tungsten Low Pressure Chemical Vapor Deposition

Ahmed A. Busnaina, Bruce S. MacGibbon
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A015, August 18–22, 1996
Paper No: 96-DETC/CIE-1351
DOI: https://doi.org/10.1115/96-DETC/CIE-1351
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Topics: Chemical vapor deposition, Contamination, Modeling, Particulate matter, Pressure, Tungsten, Temperature gradient, Boundary-value problems, Drag (Fluid dynamics), Gravity (Force)
Proceedings Papers

Fine Particle Removal Using High Frequency Acoustic Streaming

Ahmed A. Busnaina
Proc. ASME. DETC97, Volume 5: 17th Computers in Engineering Conference, V005T32A031, September 14–17, 1997
Paper No: DETC97/CIE-4436
DOI: https://doi.org/10.1115/DETC97/CIE-4436
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Topics: Acoustics, Particulate matter, Water, Contamination, Boundary layers, Chemistry, Latex, Parallel strand lumber, Semiconductors (Materials), Silicon nitride ceramics
Proceedings Papers

Environmental and Economic Impacts of Nitrogen Trifluoride at an Idaho Semiconductor Facility

Matthew A. Thompson, Amir Mohajeri, Amin Mirkouei
Proc. ASME. IDETC-CIE2020, Volume 6: 25th Design for Manufacturing and the Life Cycle Conference (DFMLC), V006T06A026, August 17–19, 2020
Paper No: DETC2020-22603
DOI: https://doi.org/10.1115/DETC2020-22603
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Topics: Emissions, Greenhouse gases, Nitrogen, Semiconductors (Materials)
Proceedings Papers

Semiconductor to Metal Transition Study of Oxidized Vanadium Thin Film

Shifeng Yu, Shuyu Wang, Ming Lu, Lei Zuo
Proc. ASME. IDETC-CIE2017, Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems, V004T09A017, August 6–9, 2017
Paper No: DETC2017-67926
DOI: https://doi.org/10.1115/DETC2017-67926
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Topics: Metals, Semiconductors (Materials), Thin films, Temperature, Atoms, Electrical resistivity, Shells
Proceedings Papers

Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

Danny J. Lohan, James T. Allison, Ercan M. Dede, Masanori Ishigaki
Proc. ASME. IDETC-CIE2016, Volume 2B: 42nd Design Automation Conference, V02BT03A013, August 21–24, 2016
Paper No: DETC2016-60218
DOI: https://doi.org/10.1115/DETC2016-60218
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Topics: Design, Optimization, Circuits, Circuit design, Damping, Electrical components, Electronics, Energy gap, Flat heat pipes, Semiconductors (Materials)
Proceedings Papers

Energy Harvesting From Torsional Vibrations Using a Nonlinear Oscillator

Ben Gunn, Panagiotis Alevras, Stephanos Theodossiades
Proc. ASME. IDETC-CIE2016, Volume 8: 28th Conference on Mechanical Vibration and Noise, V008T10A001, August 21–24, 2016
Paper No: DETC2016-59467
DOI: https://doi.org/10.1115/DETC2016-59467
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Topics: Energy harvesting, Vibration, Sensors, Excitation, Resonance, Aerospace industry, Equilibrium (Physics), Errors, Kinetic energy, Magnetic levitation
Proceedings Papers

A Methodology for Addressing Defects in Transfer Moulding as an Encapsulating Technique for Semi-Conductors

Philip Farrugia, Pierre Vella, Godwin Cutajar Kinsella
Proc. ASME. IDETC-CIE2014, Volume 1B: 34th Computers and Information in Engineering Conference, V01BT02A011, August 17–20, 2014
Paper No: DETC2014-34121
DOI: https://doi.org/10.1115/DETC2014-34121
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Topics: Semiconductors (Materials), Transfer molding, Semiconductor devices, Design, Manufacturing, Engineers, Hazards, Heat, Injection molding, Ion implantation
Proceedings Papers

Multifrequency Approaches in Characterization of Materials With Single-Pass Kelvin Force Microscopy

Sergei Magonov, John D. Alexander
Proc. ASME. IDETC-CIE2010, Volume 4: 12th International Conference on Advanced Vehicle and Tire Technologies; 4th International Conference on Micro- and Nanosystems, 533-540, August 15–18, 2010
Paper No: DETC2010-29225
DOI: https://doi.org/10.1115/DETC2010-29225
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Topics: Materials characterization, Microscopy, Resolution (Optics), Resonance, Atomic force microscopy, Imaging, Probes, Dipole moments, Metals, Semiconductors (Materials)
Proceedings Papers

Simulation of Surface Chemistry in CVD Technologies: A Detailed Deposition Model With Surface Diffusion

Sergei Klimovich, Yuriy Gorbachev, Valeria Krzhizhanovskaya
Proc. ASME. IDETC-CIE2010, Volume 3: 30th Computers and Information in Engineering Conference, Parts A and B, 211-212, August 15–18, 2010
Paper No: DETC2010-28455
DOI: https://doi.org/10.1115/DETC2010-28455
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Topics: Chemical vapor deposition, Diffusion (Physics), Simulation, Surface science, Plasmas (Ionized gases), Dynamics (Mechanics), Electronics, Flow (Dynamics), Gases, Modeling
Proceedings Papers

On the Measurement of the Overall Elastic Stiffness and Bulk Modulus in Anisotropic Materials: Semiconductors

Mohamed S. Gaith, Imad Alhayek
Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 519-524, August 30–September 2, 2009
Paper No: DETC2009-86559
DOI: https://doi.org/10.1115/DETC2009-86559
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Topics: Anisotropy, Bulk modulus, Semiconductors (Materials), Stiffness, Isotropy, Acoustooptics, Tensors, Transducers
Proceedings Papers

Computer Simulation of Laser Annealing of a Nanostructured Surface

Denis Ivanov, Ilya Marinov, Yuriy Gorbachev, Alexander Smirnov, Valeria Krzhizhanovskaya
Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1197-1198, August 30–September 2, 2009
Paper No: DETC2009-87087
DOI: https://doi.org/10.1115/DETC2009-87087
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Topics: Annealing, Computer simulation, Lasers, Metal oxide semiconductors, High temperature, Integrated circuits, Junctions, Manufacturing, Mass production, Nanoelectronics
Proceedings Papers

Performance Optimization of Semiconductor Manufacturing Equipment by the Application of Discrete Event Simulation

Markus Pfeffer, Richard Oechsner, Lothar Pfitzner, Heiner Ryssel, Berthold Ocker, Patrick Verdonck
Proc. ASME. IDETC-CIE2008, Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B, 505-513, August 3–6, 2008
Paper No: DETC2008-49274
DOI: https://doi.org/10.1115/DETC2008-49274
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Topics: Integrated circuit fabrication, Optimization, Simulation, Semiconductor wafers, Simulation models, Cycles, Semiconductors (Materials), Dimensions, Engineering prototypes, Equipment performance
Proceedings Papers

Dynamic Maskless Holographic Lithography

Nathan J. Jenness, Kurt D. Wulff, Matthew S. Johannes, Daniel G. Cole, Robert L. Clark
Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 977-984, September 4–7, 2007
Paper No: DETC2007-35164
DOI: https://doi.org/10.1115/DETC2007-35164
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Topics: Computers, DNA, Holography, Lithography, Manufacturing, Nanoscale phenomena, Semiconductors (Materials)
Proceedings Papers

Distributed-Parameters Base Modeling and Vibration Analysis of Micro-Cantilevers Used in Atomic Force Microscopy

Nader Jalili, Mohsen Dadfarnia, Darren M. Dawson
Proc. ASME. IDETC-CIE2003, Volume 5: 19th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 1643-1651, September 2–6, 2003
Paper No: DETC2003/VIB-48502
DOI: https://doi.org/10.1115/DETC2003/VIB-48502
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Topics: Atomic force microscopy, Microcantilevers, Modeling, Vibration analysis, Control equipment, Imaging, Atomic interactions, Biomaterials, Boundary-value problems, Computer simulation