In this work, the use of vertically aligned carbon nanotubes (VACNTs) as thermal interface materials is presented. The VACNT structure is fabricated on 4×4 mm silicon substrates using chemical vapor deposition (CVD). These VACNT structures can be transferred to other substrates using a thermocompression bonding process; the process transfers the VACNTs to metalized silicon die which are tested after that as thermal interface materials. Two configurations of VACNTs were tested: one with a full coverage of VACNTs and one with patterned VACNTs. For the full coverage turf a thermal interface resistance as low as 1.082 cm2K/W was obtained, while a thermal interface resistance of 0.044 cm2K/W was obtained for the patterned turfs.

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