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Proceedings Papers

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A029, October 30–November 3, 2022

Paper No: IMECE2022-94914

DOI: https://doi.org/10.1115/IMECE2022-94914

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Topics: Finite element analysis, Stress concentration, Wire, Crack propagation, Deformation, Resins, Acoustic emission testing, Damage, Electromagnetic force, Excitation

Proceedings Papers

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Qing Wang, Ming-Liang Du, Fu-Pen Chiang

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 459-465, November 16–21, 1997

Paper No: IMECE1997-0746

DOI: https://doi.org/10.1115/IMECE1997-0746

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Topics: Fracture (Materials), Micromechanics (Engineering), Steel, Stress, Fatigue, Deformation, Displacement, Carbon steel, Crack propagation, Cycles

Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Murthy V. S. L. N. Kowsika, P. Raju Mantena, K. Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 99-116, November 16–21, 1997

Paper No: IMECE1997-1035

DOI: https://doi.org/10.1115/IMECE1997-1035

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Topics: Absorption, Composite building materials, Energy dissipation, Epoxy adhesives, Epoxy resins, Glass, Graphite, Pultrusion, Delamination, Composite materials

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

David H. Allen, James W. Foulk, III, Kayleen L. E. Helms

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 109-116, November 16–21, 1997

Paper No: IMECE1997-0655

DOI: https://doi.org/10.1115/IMECE1997-0655

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Topics: Composite materials, Damage, Fibers, Titanium, Embrittlement, Failure, Crack propagation, Cracking (Materials), Fatigue, Fracture (Process)

Proceedings Papers

Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055

T. S. Srivatsan, S. Anand

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 33-50, November 15–20, 1998

Paper No: IMECE1998-1139

DOI: https://doi.org/10.1115/IMECE1998-1139

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Topics: Aluminum alloys, Damage, Deformation, Fatigue, Temperature, Stress, Alloys, Compression, Crack propagation, Dislocations

Proceedings Papers

Failure Prediction of Bonded Joints of Composite Engineering Structures

Alexander E. Bogdanovich, Sergei P. Yushanov

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 267-268, November 15–20, 1998

Paper No: IMECE1998-1199

DOI: https://doi.org/10.1115/IMECE1998-1199

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Topics: Composite materials, Failure, Structures, Adhesives, Fracture (Materials), Bricks, Displacement, Crack propagation, Failure mechanisms, Temperature

Proceedings Papers

Fatigue and Fracture Testing of Microelectromechanical Systems

Roberto Ballarini, Robert L. Mullen, Harold Kahn, Arthur H. Heuer

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 151-152, November 15–20, 1998

Paper No: IMECE1998-1152

DOI: https://doi.org/10.1115/IMECE1998-1152

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Topics: Fatigue, Fracture (Materials), Fracture (Process), Microelectromechanical systems, Testing, Bending strength, Crack propagation, Design, Dimensions, Electrostatic actuators

Proceedings Papers

Fatigue Crack Propagation Under Variable-Amplitude Load: Part II — A Stochastic Model

Asok Ray, Ravindra Patankar

Proc. ASME. IMECE98, Dynamic Systems and Control, 23-30, November 15–20, 1998

Paper No: IMECE1998-0229

DOI: https://doi.org/10.1115/IMECE1998-0229

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Topics: Fatigue cracks, Stress, Aircraft, Algorithms, Alloys, Aluminum alloys, Complex systems, Crack propagation, Differential equations, Fracture (Materials)

Proceedings Papers

Crack Propagation and Fracture Toughness of Additively Manufactured Polymers

Mohammad Khairul Habib Pulok, M. Shafiqur Rahman, Uttam K. Chakravarty

Proc. ASME. IMECE2021, Volume 4: Advances in Aerospace Technology, V004T04A027, November 1–5, 2021

Paper No: IMECE2021-72061

DOI: https://doi.org/10.1115/IMECE2021-72061

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Topics: Additive manufacturing, Crack propagation, Fatigue, Fracture toughness, Polymers

Proceedings Papers

Numerical Modal Sensitivity Analysis for Fatigue Damage Accumulation in Adhesively Bonded Lap-Joint

Rajendra Prasath Palanisamy, Portia Banerjee, Mahmood Haq, Yiming Deng

Proc. ASME. IMECE2021, Volume 1: Acoustics, Vibration, and Phononics, V001T01A014, November 1–5, 2021

Paper No: IMECE2021-73587

DOI: https://doi.org/10.1115/IMECE2021-73587

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Topics: Fatigue damage, Sensitivity analysis, Fracture (Materials), Damage, Crack propagation, Failure, Waves, Adhesives, Crack detection, Engineering simulation

Proceedings Papers

Influencing the Mechanical Properties of Fused Filament Fabrication Parts by Non-Planar Material Extrusion

Rhys Edwards, Lee Clemon

Proc. ASME. IMECE2021, Volume 2A: Advanced Manufacturing, V02AT02A007, November 1–5, 2021

Paper No: IMECE2021-70144

DOI: https://doi.org/10.1115/IMECE2021-70144

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Topics: Additive manufacturing, Extruding, Manufacturing, Mechanical properties, Stress, Fracture toughness, Machinery, Anisotropy, Bonding, Brittleness

Proceedings Papers

Applied Machine Learning Method to Predict Crack Propagation Path in Polycrystalline Graphene Sheet

Mohan S. R. Elapolu, Md. Imrul Reza Shishir, Alireza Tabarraei

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A011, November 1–5, 2021

Paper No: IMECE2021-70543

DOI: https://doi.org/10.1115/IMECE2021-70543

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Topics: Crack propagation, Graphene, Machine learning

Proceedings Papers

Application of Joint-Time Frequency Analysis Methods for Nondestructive Evaluation

Ki-Woo Nam, Kun-Chan Lee, Jeong-Hwan Oh

Proc. ASME. IMECE99, On the Recent Advances of the Ultrasonic Nondestructive Evaluation and Composite Material Characterization, 67-74, November 14–19, 1999

Paper No: IMECE1999-0890

DOI: https://doi.org/10.1115/IMECE1999-0890

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Topics: Nondestructive evaluation, Signals, Damage, Time-frequency analysis, Acoustic emissions, Aluminum alloys, Crack propagation, Fatigue, Fatigue cracks, Fourier transforms

Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999

Paper No: IMECE1999-0925

DOI: https://doi.org/10.1115/IMECE1999-0925

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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging

Proceedings Papers

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 139-147, November 14–19, 1999

Paper No: IMECE1999-0926

DOI: https://doi.org/10.1115/IMECE1999-0926

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Topics: Fracture (Materials), Nucleation (Physics), Damage, Cycles, Crack propagation, Dislocations, Fatigue cracks, Fracture mechanics, Microscale devices, Springs

Proceedings Papers

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

Brian J. Lewis, Hilary Sasso

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 47-52, November 14–19, 1999

Paper No: IMECE1999-0916

DOI: https://doi.org/10.1115/IMECE1999-0916

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Topics: Flip-chip devices, Reliability, Solders, Manufacturing, Crack propagation, Delamination, Engineers, Failure mechanisms, Flip-chip assemblies, Optimization

Proceedings Papers

Efficient Computation of Strain Energy Release Rate in Crack Growth Simulation

D. J. Chen

Proc. ASME. IMECE99, Durability and Damage Tolerance of Composite Materials and Structures, 71-78, November 14–19, 1999

Paper No: IMECE1999-0505

DOI: https://doi.org/10.1115/IMECE1999-0505

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Topics: Computation, Fracture (Materials), Simulation, Crack propagation, Condensation, Density, Errors, Finite element analysis, Finite element model, Modeling

Proceedings Papers

On Crack Extension in TSD Specimen With Foam Core

Xiaoming Li, Leif A. Carlsson

Proc. ASME. IMECE99, Advances in Aerospace Materials and Structures, 15-22, November 14–19, 1999

Paper No: IMECE1999-0131

DOI: https://doi.org/10.1115/IMECE1999-0131

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Topics: Fracture (Materials), Stress, Crack propagation, Finite element analysis, Sandwich structures

2 3 4 5

NARROW

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Investigation of the Lead-On-Chip Package’s Reliability

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055

Failure Prediction of Bonded Joints of Composite Engineering Structures

Fatigue and Fracture Testing of Microelectromechanical Systems

Fatigue Crack Propagation Under Variable-Amplitude Load: Part II — A Stochastic Model

Crack Propagation and Fracture Toughness of Additively Manufactured Polymers

Numerical Modal Sensitivity Analysis for Fatigue Damage Accumulation in Adhesively Bonded Lap-Joint

Influencing the Mechanical Properties of Fused Filament Fabrication Parts by Non-Planar Material Extrusion

Applied Machine Learning Method to Predict Crack Propagation Path in Polycrystalline Graphene Sheet

Application of Joint-Time Frequency Analysis Methods for Nondestructive Evaluation

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

Efficient Computation of Strain Energy Release Rate in Crack Growth Simulation

On Crack Extension in TSD Specimen With Foam Core

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