Search Results | IMECE | ASME Digital Collection

1-20 of 269

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

Nonlinear Electro-Mechanical Impedance Spectroscopy for Comprehensive Monitoring of Carbon Fiber Reinforced Composite Laminates

Runye Lu, Yanfeng Shen

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A014, October 30–November 3, 2022

Paper No: IMECE2022-94882

DOI: https://doi.org/10.1115/IMECE2022-94882

View Paper

Topics: Carbon fibers, Composite materials, Delamination, Electrochemical impedance spectroscopy, Laminates

Proceedings Papers

A Modified Time Reversal Based Probabilistic Imaging Method for Composite Plate Delamination Detection

Yang Nan, Maoling Yue, Haodong Fan, Fei Du, Lihua Wen, Chao Xu

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A013, October 30–November 3, 2022

Paper No: IMECE2022-94805

DOI: https://doi.org/10.1115/IMECE2022-94805

View Paper

Topics: Composite materials, Delamination, Imaging, Time reversal

Proceedings Papers

Guided Wave Damage Imaging of Composite Laminates With Least-Squares Reverse-Time Migration (LSRTM)

Jiaze He, Anthony Schwarberg

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A005, October 30–November 3, 2022

Paper No: IMECE2022-90231

DOI: https://doi.org/10.1115/IMECE2022-90231

View Paper

Topics: Composite materials, Damage, Imaging, Laminates, Waves, Modeling, Nondestructive evaluation, Plates (structures), Resolution (Optics), Structural health monitoring

Proceedings Papers

Quantitative Detection of Delaminations in CFRP Composite Plate by Spatial-Frequency-Wavenumber Analysis Based on Laser Ultrasonic Guided Waves

Zenghua Liu, Xiaoyu Liu, Jiuzhou Tian

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A019, October 30–November 3, 2022

Paper No: IMECE2022-95421

DOI: https://doi.org/10.1115/IMECE2022-95421

View Paper

Topics: Carbon reinforced plastics, Composite materials, Delamination, Guided wave ultrasonic testing, Lasers, Waves

Proceedings Papers

Development of a Predictive Model and Optimization for the Kerf Properties and Delamination Length in AWJM of Kevlar Epoxy Composite

Puneet Kumar, Sachin Salunkhe, Ragavanantham Shanmugam, Basanta Kumar Bhuyan, Anil Kumar Dahiya, Yuvaraj N.

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A016, October 30–November 3, 2022

Paper No: IMECE2022-96214

DOI: https://doi.org/10.1115/IMECE2022-96214

View Paper

Topics: Composite materials, Delamination, Epoxy adhesives, Epoxy resins, Machining, Optimization, Response surface methodology, Water

Proceedings Papers

Effect of Metallic Insert Design Parameters on the Load-Carrying Capacity of GFRP Bolted Connection

Amr Elbshbeshy, Mahmoud Ali, Mostafa Shazly, Yehia Bahei-El-Din

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A013, October 30–November 3, 2022

Paper No: IMECE2022-93382

DOI: https://doi.org/10.1115/IMECE2022-93382

View Paper

Topics: Bolted joints, Design, Finite element analysis, Glass reinforced plastics, Load bearing capacity, Failure, Fibers, Laminates, Stress, Bearings

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

View Paper

Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

Proceedings Papers

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Murthy V. S. L. N. Kowsika, P. Raju Mantena, K. Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 99-116, November 16–21, 1997

Paper No: IMECE1997-1035

DOI: https://doi.org/10.1115/IMECE1997-1035

View Paper

Topics: Absorption, Composite building materials, Energy dissipation, Epoxy adhesives, Epoxy resins, Glass, Graphite, Pultrusion, Delamination, Composite materials

Proceedings Papers

Low-Velocity Impact Response and Evaluation of Delamination Damage in CFRP Laminates

Mahesh. V. Hosur, C. R. L. Murthy, T. S. Ramamurthy

Proc. ASME. IMECE97, Noise Control and Acoustics, 203-214, November 16–21, 1997

Paper No: IMECE1997-1046

DOI: https://doi.org/10.1115/IMECE1997-1046

View Paper

Topics: Carbon reinforced plastics, Damage, Delamination, Laminates, Joules, Stress, Composite materials, Displacement, Energy levels (Quantum mechanics), Image processing

Proceedings Papers

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Vinay Dayal

Proc. ASME. IMECE97, Noise Control and Acoustics, 155-160, November 16–21, 1997

Paper No: IMECE1997-1040

DOI: https://doi.org/10.1115/IMECE1997-1040

View Paper

Topics: Acoustic emissions, Epoxy adhesives, Epoxy resins, Graphite, Nondestructive evaluation, Buckling, Composite materials, Compression, Delamination

Proceedings Papers

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Gene J. Quattlebaum, P. K. Raju

Proc. ASME. IMECE97, Noise Control and Acoustics, 167-175, November 16–21, 1997

Paper No: IMECE1997-1042

DOI: https://doi.org/10.1115/IMECE1997-1042

View Paper

Topics: Aluminum, Composite materials, Graphite, Nondestructive evaluation, Ultrasonics, Adhesives, Bond strength, Carbon, Damage, Tensile strength

Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997

Paper No: IMECE1997-0496

DOI: https://doi.org/10.1115/IMECE1997-0496

View Paper

Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

View Paper

Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

View Paper

Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

View Paper

Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997

Paper No: IMECE1997-0514

DOI: https://doi.org/10.1115/IMECE1997-0514

View Paper

Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

View Paper

Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

View Paper

Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Ajit D. Kelkar, J. Sankar, C. Grace, Roger J. Aschenbrenner, Gregory Schoeppner

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 39-46, November 16–21, 1997

Paper No: IMECE1997-0521

DOI: https://doi.org/10.1115/IMECE1997-0521

View Paper

Topics: Composite materials, Stress, Laminates, Damage, Aircraft, Fiber reinforced composites, Graphite, Weight (Mass), Damage mechanics, Deformation

Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997

Paper No: IMECE1997-0676

DOI: https://doi.org/10.1115/IMECE1997-0676

View Paper

Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling

2 3 4 5

NARROW

Nonlinear Electro-Mechanical Impedance Spectroscopy for Comprehensive Monitoring of Carbon Fiber Reinforced Composite Laminates

A Modified Time Reversal Based Probabilistic Imaging Method for Composite Plate Delamination Detection

Guided Wave Damage Imaging of Composite Laminates With Least-Squares Reverse-Time Migration (LSRTM)

Quantitative Detection of Delaminations in CFRP Composite Plate by Spatial-Frequency-Wavenumber Analysis Based on Laser Ultrasonic Guided Waves

Development of a Predictive Model and Optimization for the Kerf Properties and Delamination Length in AWJM of Kevlar Epoxy Composite

Effect of Metallic Insert Design Parameters on the Load-Carrying Capacity of GFRP Bolted Connection

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Low-Velocity Impact Response and Evaluation of Delamination Damage in CFRP Laminates

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Nondestructive Elastic Property Characterization of IC Encapsulants

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Reliability of Underfill-Encapsulated Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Process Modeling and Interfacial Behavior in the VSPA Package

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only