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Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

A Simulation System for Feasibility Study of Single Set-Up Fixtures in Milling and Drilling

Xiaoping Li, Andrew Y. C. Nee

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 213-220, November 16–21, 1997

Paper No: IMECE1997-1155

DOI: https://doi.org/10.1115/IMECE1997-1155

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Topics: Drilling, Milling, Simulation, Deformation, Design, Cutting, Deflection, Finite element methods, Machining, Materials properties

Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997

Paper No: IMECE1997-1107

DOI: https://doi.org/10.1115/IMECE1997-1107

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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance

Proceedings Papers

Prediction of Quasistatic Errors in Three-Axis CNC Machining Centers

Xiong-Biao Chen, Aseervadam Geddam

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 55-62, November 16–21, 1997

Paper No: IMECE1997-1075

DOI: https://doi.org/10.1115/IMECE1997-1075

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Topics: Computer numerical control machine tools, Errors, Machining centers, Finite element methods, Finite element model, Kinematics, Machine tools

Proceedings Papers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

David H. Allen, James W. Foulk, III, Kayleen L. E. Helms

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 109-116, November 16–21, 1997

Paper No: IMECE1997-0655

DOI: https://doi.org/10.1115/IMECE1997-0655

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Topics: Composite materials, Damage, Fibers, Titanium, Embrittlement, Failure, Crack propagation, Cracking (Materials), Fatigue, Fracture (Process)

Proceedings Papers

Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method

Vinodh Swaminathan, Micheal J. Koczak, Surya R. Kalidindi

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 65-72, November 16–21, 1997

Paper No: IMECE1997-0652

DOI: https://doi.org/10.1115/IMECE1997-0652

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Topics: Finite element methods, High temperature, Simulation, Finite element analysis, Heat, Ceramics, Composite materials, Energy efficiency, Heat losses, Intermetallic compounds

Proceedings Papers

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Yu-Lin Shen

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 385-392, November 16–21, 1997

Paper No: IMECE1997-0689

DOI: https://doi.org/10.1115/IMECE1997-0689

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Topics: Ceramic composites, Thermal expansion, Thermal management, Composite materials, Particulate matter, Computer simulation, Deformation, Finite element methods, Micromechanical devices, Porosity

Proceedings Papers

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997

Paper No: IMECE1997-0823

DOI: https://doi.org/10.1115/IMECE1997-0823

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Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys

Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997

Paper No: IMECE1997-0810

DOI: https://doi.org/10.1115/IMECE1997-0810

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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging

Proceedings Papers

Simulation of 3-D Mold-Filling and Solidification Processes on Distributed Memory Parallel Architectures

Florin Ilinca, Jean-François Hétu, Martin Audet, Randall Bramley

Proc. ASME. IMECE97, Fluids Engineering, 477-484, November 16–21, 1997

Paper No: IMECE1997-0805

DOI: https://doi.org/10.1115/IMECE1997-0805

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Topics: Architecture, Simulation, Solidification, Algorithms, Finite element analysis, Turbulence, Computer programming, Finite element methods, Flow (Dynamics), Heat transfer

Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997

Paper No: IMECE1997-0814

DOI: https://doi.org/10.1115/IMECE1997-0814

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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry

Proceedings Papers

Computer Aided Modeling of Induced Strain Actuators and Other Piezoelectric Structures

Philippe Bouchilloux, R. Le Letty, N. Lhermet, F. Claeyssen

Proc. ASME. IMECE97, Dynamic Systems and Control, 307-312, November 16–21, 1997

Paper No: IMECE1997-0410

DOI: https://doi.org/10.1115/IMECE1997-0410

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Topics: Actuators, Computer-aided engineering, Modeling, Design, Finite element methods, Active damping, Design methodology, Electronics, Engineering simulation, Mechatronic devices

Proceedings Papers

Modelling of Oxygen Diffusion in Pulmonary Capillaries

Andreas O. Frank, C. J. Charles Chuong

Proc. ASME. IMECE97, Advances in Bioengineering, 45-46, November 16–21, 1997

Paper No: IMECE1997-0220

DOI: https://doi.org/10.1115/IMECE1997-0220

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Topics: Diffusion (Physics), Modeling, Oxygen, Erythrocytes, Finite element methods, Flow (Dynamics), Geometry, Lung, Membranes

Proceedings Papers

Numerical Simulation of Inertia Welding of Inconel 718

Vikran Balasubramanian, Youlin Li, Tim Stotler, Jeff Crompton, Noriko Katsube, Winston O. Soboyejo

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 289-295, November 16–21, 1997

Paper No: IMECE1997-0545

DOI: https://doi.org/10.1115/IMECE1997-0545

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Topics: Computer simulation, Friction welding, Heat, Temperature distribution, Finite element analysis, Finite element methods, Inertia (Mechanics), Microhardness, Numerical analysis, Steel

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Alfred G. Striz, Keyur Thakore

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 109-117, November 16–21, 1997

Paper No: IMECE1997-0528

DOI: https://doi.org/10.1115/IMECE1997-0528

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Topics: Fluids, Fracture (Process), Stability, Buckling, Pressure, Finite element methods, Plates (structures), Boundary-value problems, Design, Engineering standards

Proceedings Papers

Vibration Control of Tubes With Internally Moving Loads Using Active Constrained Layer Damping

J. Ro, K. S. El-Din, A. Baz

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 1-11, November 16–21, 1997

Paper No: IMECE1997-0554

DOI: https://doi.org/10.1115/IMECE1997-0554

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Topics: Active damping, Pavement live loads, Vibration control, Damping, Vibration, Control equipment, Feedback, Finite element methods, Finite element model, Passive damping

Proceedings Papers

Large Deflection FEM Analysis of Thermally Loaded, Stiffened, Shear Deformable Plates

Erasmo Carrera, Liviu Librescu

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 141-154, November 16–21, 1997

Paper No: IMECE1997-0531

DOI: https://doi.org/10.1115/IMECE1997-0531

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Topics: Deflection, Finite element methods, Finite element model, Plates (structures), Shear (Mechanics), Accounting, Algebra, Approximation, Finite element analysis, Newton's method

Proceedings Papers

A Robust Design Methodology for Structural Control Using Piezoelectric Materials

M. Sunar, S. J. Hyder, R. Kahraman

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 47-53, November 16–21, 1997

Paper No: IMECE1997-0558

DOI: https://doi.org/10.1115/IMECE1997-0558

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Topics: Design methodology, Piezoelectric materials, Actuators, Control systems, Finite element methods, Flexible structures, Piezoelectric actuators, Robustness, Temperature effects

2 3 4 5

NARROW

Sequential Processing Mechanics Modeling for a Model IC Package

CBGA Solder Fillet Shape Prediction and Design Optimization

A Simulation System for Feasibility Study of Single Set-Up Fixtures in Milling and Drilling

Thermal Performance Evaluation of VBGA Packages

Prediction of Quasistatic Errors in Three-Axis CNC Machining Centers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Comparison of Different Solder Systems Based on Propensity for Damage

Design Considerations in Avionics Electronic Packaging

Simulation of 3-D Mold-Filling and Solidification Processes on Distributed Memory Parallel Architectures

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

Computer Aided Modeling of Induced Strain Actuators and Other Piezoelectric Structures

Modelling of Oxygen Diffusion in Pulmonary Capillaries

Numerical Simulation of Inertia Welding of Inconel 718

Reliability of Underfill-Encapsulated Flip-Chip Packages

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Vibration Control of Tubes With Internally Moving Loads Using Active Constrained Layer Damping

Large Deflection FEM Analysis of Thermally Loaded, Stiffened, Shear Deformable Plates

A Robust Design Methodology for Structural Control Using Piezoelectric Materials

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