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Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Paper No: IMECE1997-1220
DOI: https://doi.org/10.1115/IMECE1997-1220
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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997
Paper No: IMECE1997-1213
DOI: https://doi.org/10.1115/IMECE1997-1213
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Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Jagannath Raghavan, Muhammad M. Rahman
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 337-346, November 16–21, 1997
Paper No: IMECE1997-0859
DOI: https://doi.org/10.1115/IMECE1997-0859
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Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction
Proceedings Papers

Utilization of Standard CMOS Layers for Microchannels

Angela Rasmussen, Laurie E. Locascio, Michael Gaitan, Mona E. Zaghloul
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 407-411, November 15–20, 1998
Paper No: IMECE1998-1277
DOI: https://doi.org/10.1115/IMECE1998-1277
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Topics: Complementary metal oxide semiconductors, Microchannels, Micromachining, Actuators, Electronics, Integrated circuits, Metals, Sensors
Proceedings Papers

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Krishnan Nandakumar, Allen G. Parr, Geon Hahm, Michael A. Huff, Stephen M. Phillips
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 139-143, November 15–20, 1998
Paper No: IMECE1998-1234
DOI: https://doi.org/10.1115/IMECE1998-1234
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Topics: Feedback, Shape memory alloys, Valves, Flow (Dynamics), Flow sensors, Micromachining, Air flow, Control equipment, Electronics, Fluids
Proceedings Papers

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

K. Kurabayashi, M. Asheghi, M. N. Touzelbaev, K. E. Goodson
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 71-81, November 15–20, 1998
Paper No: IMECE1998-0431
DOI: https://doi.org/10.1115/IMECE1998-0431
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Topics: Anisotropy, Electronic systems, Polymer films, Thermal characterization, Micromachining, Temperature, Thermal conductivity, Actuators, Heating, Integrated circuits
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Paper No: IMECE1998-0650
DOI: https://doi.org/10.1115/IMECE1998-0650
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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits
Proceedings Papers

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Chi-Te Chin, James N. Fordemwalt, Jong-I Mou
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 53-58, November 15–20, 1998
Paper No: IMECE1998-1015
DOI: https://doi.org/10.1115/IMECE1998-1015
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Topics: Circuits, Complementary metal oxide semiconductors, Computer-aided design, Delays, Diffusion (Physics), Gates (Closures), Integrated circuits, Junctions, Manufacturing, Metal oxide semiconductors
Proceedings Papers

Three-Dimensional Simulation of Microchip Encapsulation Processes

Ruihua Han, Mahesh Gupta
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 757-766, November 15–20, 1998
Paper No: IMECE1998-1090
DOI: https://doi.org/10.1115/IMECE1998-1090
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Topics: Integrated circuits, Simulation, Flow (Dynamics), Fluids, Finite element analysis, Inertia (Mechanics), Pressure
Proceedings Papers

MEMS-Based Test Structures for IC Technology

Stephen A. Smee, Michael Gaitan, Yogendra Joshi
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 147-149, November 15–20, 1998
Paper No: IMECE1998-1151
DOI: https://doi.org/10.1115/IMECE1998-1151
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Topics: Delamination, Density, Electrodiffusion, Failure, Integrated circuits, Microelectromechanical systems, Probability, Reliability, Stress, Thermomechanics
Proceedings Papers

Experimental Study of Gas-Liquid Displacement in a Porous Media Microchip by Digital Image Analysis Method

Shuo Yang, Gaopan Kong, Zan Wu
Proc. ASME. IMECE2021, Volume 10: Fluids Engineering, V010T10A041, November 1–5, 2021
Paper No: IMECE2021-69902
DOI: https://doi.org/10.1115/IMECE2021-69902
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Topics: Displacement, Integrated circuits, Porous materials
Proceedings Papers

Modeling, Design and Fabrication of a Microdevice for E-Field Cell Lysis

Thomas Smekal, Cindy Briscoe, Tony Chan, Yung Chang, Seth Dobrin, Sean Gallagher, Heidi Groninger, Rob Marrero, David Rhine, Huinan Yu, Piotr Grodzinski
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 235-240, November 14–19, 1999
Paper No: IMECE1999-0273
DOI: https://doi.org/10.1115/IMECE1999-0273
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Topics: Design, Manufacturing, Modeling, Electric fields, Electrodes, DNA, Integrated circuits, Microfluidics, Optimization
Proceedings Papers

Multiple Through-Wafer Interconnects for Stacking of Microsystems

Matthias Heschel, Kurt Rasmussen, Jochen F. Kuhmann, Siebe Bouwstra
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 537-540, November 14–19, 1999
Paper No: IMECE1999-0317
DOI: https://doi.org/10.1115/IMECE1999-0317
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Topics: Microelectromechanical systems, Semiconductor wafers, Microphones, Bonding, Adhesives, Capacitance, Copper, Electroplating, Integrated circuits, Metals
Proceedings Papers

Surface Micromachine Microfluidics: Design, Fabrication, Packaging, and Characterization

Paul Galambos, William P. Eaton, Randy Shul, Christi Gober Willison, Jeffry J. Sniegowski, Samuel L. Miller, Daniel Gutierrez
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 441-448, November 14–19, 1999
Paper No: IMECE1999-0303
DOI: https://doi.org/10.1115/IMECE1999-0303
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Topics: Design, Manufacturing, Microfluidics, Packaging, Micromachining, Fluids, Flow (Dynamics), Integrated circuits, Leakage, Polysilicon
Proceedings Papers

A Composite Sandwich Structure With Embedded MEMS-Based Vibration Sensing

Kishore Pochiraju
Proc. ASME. IMECE99, Adaptive Structures and Material Systems, 213-218, November 14–19, 1999
Paper No: IMECE1999-0546
DOI: https://doi.org/10.1115/IMECE1999-0546
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Topics: Composite materials, Microelectromechanical systems, Sandwich structures, Vibration, Accelerometers, Boundary-value problems, Free vibrations, Sensors, Adaptive structures, Data acquisition
Proceedings Papers

Performance of Thermal Enhancements in Chip on Flex

Gary Miller, Chittaranjan Sahay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 107-110, November 14–19, 1999
Paper No: IMECE1999-0923
DOI: https://doi.org/10.1115/IMECE1999-0923
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Topics: Blocks (Building materials), Construction, Density, Economics , Engines, Integrated circuits
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Paper No: IMECE1999-0922
DOI: https://doi.org/10.1115/IMECE1999-0922
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Paper No: IMECE2001/HTD-24377
DOI: https://doi.org/10.1115/IMECE2001/HTD-24377
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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)