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1-13 of 13
Keywords: delamination
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Proceedings Papers
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A014, October 30–November 3, 2022
Paper No: IMECE2022-94882
... the incipient damage like delamination is simulated by setting the contact interfacing condition between the laminate debonding areas. Correspondingly, the chirp-based impedance spectra are employed to detect the macro-scale damage via the deviation of resonance peaks, while the nonlinear features...
Proceedings Papers
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A019, October 30–November 3, 2022
Paper No: IMECE2022-95421
... Abstract To comprehensively quantitative assessment of delamination location in CFRP composite plates, a Lamb wave spatial frequency wavenumber imaging method based on laser ultrasonic full-wavefield scanning inspection is proposed in this paper. For a CFRP composite plate specimen containing...
Proceedings Papers
Proc. ASME. IMECE2021, Volume 1: Acoustics, Vibration, and Phononics, V001T01A009, November 1–5, 2021
Paper No: IMECE2021-69157
... Abstract A laminated beam consisted of internally embedded d15 piezoelectric transducers in a pitch-catch configuration was fabricated with artificial delamination created at the interface of aluminum layers. The severity of damage was also varied to evaluate the effectiveness of the approach...
Proceedings Papers
Proc. ASME. IMECE2020, Volume 2B: Advanced Manufacturing, V02BT02A032, November 16–19, 2020
Paper No: IMECE2020-23302
.... Experimental data is used for ANOVA (balanced) analysis. The cutting parameters such as feed rate, cutting speed and tool type (coating) are considered as input and the measured thrust force, delamination factor and AE RMS signal are treated as output responses. From ANOVA results, it is observed...
Proceedings Papers
Mohammed Oudah E. Al-Harbi, Mohammed Saleh M. Almansour, Yousef Ali M. Alomair, Fahad Nabat B. Altulohi, M. Osman, Ibrahim M. Alarifi
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A006, November 11–14, 2019
Paper No: IMECE2019-10307
...-carbon fibers, which allows the use of such fibers for the reinforcement of plastics without extra processing. auxetic nano-carbon fiber delamination DMA reinforcement composite pyrolysis EVALUATE THE MECHANICAL AND THERMAL BEHAVIOURAL DEFORMATION OF AUXETIC COMPOSITE NANO-CARBON FIBERS...
Proceedings Papers
Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A024, November 11–14, 2019
Paper No: IMECE2019-10928
... Abstract This paper presents a delamination detection strategy for composite plates using linear and nonlinear ultrasonic guided waves via the wave field imaging and signal processing based on Scanning Laser Doppler Vibrometry (SLDV). The anisotropic elastodynamics in composite plates is first...
Proceedings Papers
Proc. ASME. IMECE2019, Volume 2A: Advanced Manufacturing, V02AT02A019, November 11–14, 2019
Paper No: IMECE2019-11191
... in the drilling of CFRP/Ti stacks include rapid tool wear and poor hole quality. Typically, the surface quality of the holes in the drilling of CFRP/Ti stack is poor due to delamination, the progression of hole diameter in CFRP and burr formation in Ti. Moreover, the flank wear on the tool also influences...
Proceedings Papers
Holalu Venkatadasu Ravindra, Nodekoppalu Lingaiah Murali Krishna, Rakshith Gowda Doddagarudanahalli Shivaramaiah
Proc. ASME. IMECE2019, Volume 2A: Advanced Manufacturing, V02AT02A018, November 11–14, 2019
Paper No: IMECE2019-11188
..., delamination and surface roughness. Simulation results depict the influence of thrust force and torque on the degree of deformation, strength, elasticity and stress distribution in the work material during drilling. From the simulation, it is found that deformation, and equivalent stress in the material...
Proceedings Papers
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 173-178, November 12–18, 2010
Paper No: IMECE2010-37804
..., provided proper tool design and operating conditions are adopted. In this paper, A genetic algorithm (GA) based optimization procedure has been developed to optimize two factors, material removal rate; and delamination factor, using multi-objective function model with a weighted approach...
Proceedings Papers
Proc. ASME. IMECE2002, Nondestructive Evaluation, 5-10, November 17–22, 2002
Paper No: IMECE2002-33430
... of curvatures of 150 mm showed quite different impact response and damage behavior from that of flat laminate. Under the same impact energy level, the maximum contact force varied with the radius of curvatures, which is directly related to the impact damage. Delamination was distributed rather evenly at each...
Proceedings Papers
Proc. ASME. IMECE2002, Manufacturing, 523-530, November 17–22, 2002
Paper No: IMECE2002-33730
... an underfilled package. Simulation results have shown that moisture-induced ACF swelling and delamination is the major cause of ACF failure. With moisture absorption, the loading condition at the interface is tensile-dominant, which corresponds to lower interface toughness (or fracture resistance...
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 371-374, November 5–11, 2005
Paper No: IMECE2005-81892
..., delamination. NOMENCLATURE R Electrical contact resistance F Initial bonding force E Modulus of elasticity of the cured resin GA Adhesion strength of the joint N Number of particles the resin matrix has cured, the bonding force is removed. This adhesive matrix, usually a thermosetting epoxy resin, is expected...
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 223-228, November 5–10, 2006
Paper No: IMECE2006-13014
... of the common failure modes, delamination is often encountered due to pre-existing defect and external loadings, such as thermal stress caused by different CTE of materials, hydro-swelling stress and vapor pressure caused by moisture desorption during reflow soldering. In SCSP, delamination often occurs along...