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Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2605
https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2608
https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48303
https://doi.org/10.1115/IPACK2015-48303
View Paper titled, The Detection of Minimum BLT Condition With Electrical Capacitance Measurement
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Topics: Capacitance, Heat, Fillers (Materials), Heat sinks, Solids, Electrical measurement, Mass production, Pressure, Semiconductor devices, Silicones
Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48430
https://doi.org/10.1115/IPACK2015-48430
View Paper titled, Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption
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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure
Proceedings Papers

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48625
https://doi.org/10.1115/IPACK2015-48625
View Paper titled, Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module
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Topics: Temperature measurement, Water, Flow (Dynamics), Thermal resistance, Capacitance, Computer simulation, Design, Heat, Heat transfer, Junctions
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73250
https://doi.org/10.1115/IPACK2013-73250
View Paper titled, Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging
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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)
Proceedings Papers

A Transient Model for Parallel Flow and Counter Flow Heat Exchangers

K. Abbasi, M. Del Valle, A. P. Wemhoff, A. Ortega
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73118
https://doi.org/10.1115/IPACK2013-73118
View Paper titled, A Transient Model for Parallel Flow and Counter Flow Heat Exchangers
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Topics: Flow (Dynamics), Heat exchangers, Transients (Dynamics), Fluids, Capacitance, Exterior walls, Finite volume methods, Heat conduction, Heat transfer coefficients, Steady state
Proceedings Papers

A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

Stephen H. Taylor, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A051, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73283
https://doi.org/10.1115/IPACK2013-73283
View Paper titled, A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions
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Topics: Capacitance, Electrodes, Junctions, Electric fields, Design, Sensors, Circuits, Dimensions, Fracture (Materials), Network models
Proceedings Papers

Transient Thermal Response of Servers Through Air Temperature Measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73281
https://doi.org/10.1115/IPACK2013-73281
View Paper titled, Transient Thermal Response of Servers Through Air Temperature Measurements
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Topics: Temperature measurement, Transients (Dynamics), Capacitance, Temperature, Computational fluid dynamics, Data centers, Thermal conductivity
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33330
https://doi.org/10.1115/IPACK2007-33330
View Paper titled, Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)
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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula

Xiangyin Zeng, Jiangqi He, Baoshu Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1969-1972, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73308
https://doi.org/10.1115/IPACK2005-73308
View Paper titled, Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula
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Topics: Capacitors, Design, Inductors, Capacitance, Computer software, Curve fitting, Errors, Filters, Q-factor, Tolerance analysis
Proceedings Papers

A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)

Terry Dishongh, Damion Searls, Weston C. Roth, Erik Peter
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 33-36, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35207
https://doi.org/10.1115/IPACK2003-35207
View Paper titled, A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)
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Topics: Ball-Grid-Array packaging, Capacitors, Design, Stress, Manufacturing, Capacitance, Transients (Dynamics), Design methodology, Engineering prototypes, Silicon
Proceedings Papers

Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process

David C. Whalley, Helge Kristiansen, Johan Liu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 183-189, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35238
https://doi.org/10.1115/IPACK2003-35238
View Paper titled, Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process
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Topics: Adhesives, Anisotropy, Compression, Manufacturing, Flow (Dynamics), Particulate matter, Resins, Actuators, Adhesive resins, Capacitance
Proceedings Papers

New Substrates for Use as Embedded Capacitors

Takuya Yamamoto, John Andresakis
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 741-745, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35230
https://doi.org/10.1115/IPACK2003-35230
View Paper titled, New Substrates for Use as Embedded Capacitors
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Topics: Capacitors, Capacitance, Breakdown (Electricity), Diluents, Epoxy adhesives, Epoxy resins, Laminates, Lumber