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Proceedings Papers

Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow

Masahiro Muraoka, Yuuki Kumagai, Yuuta Yatagawa, Ichiro Ueno
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A016, July 6–9, 2015
Paper No: IPACK2015-48241
DOI: https://doi.org/10.1115/IPACK2015-48241
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Topics: Creeping flow, Drops, Flow (Dynamics), Reynolds number, Clearances (Engineering)
Proceedings Papers

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A045, July 6–9, 2015
Paper No: IPACK2015-48607
DOI: https://doi.org/10.1115/IPACK2015-48607
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Topics: Cooling, Flow (Dynamics), Generators, Heat sinks, Vortices, Water, Heat, Density, Electric vehicles, Energy dissipation
Proceedings Papers

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015
Paper No: IPACK2015-48017
DOI: https://doi.org/10.1115/IPACK2015-48017
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Topics: Design, Manufacturing, Micropumps, Flow (Dynamics), Blades, Computational fluid dynamics, Emissions, Impellers, Pressure, Pumps
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Paper No: IPACK2013-73214
DOI: https://doi.org/10.1115/IPACK2013-73214
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009
Paper No: InterPACK2009-89103
DOI: https://doi.org/10.1115/InterPACK2009-89103
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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency
Proceedings Papers

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Ning Lei, Alfonso Ortega
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 291-298, July 17–22, 2005
Paper No: IPACK2005-73222
DOI: https://doi.org/10.1115/IPACK2005-73222
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Topics: Heat sinks, Thermal characterization, Clearances (Engineering), Flow (Dynamics), Thermal resistance, Heat transfer coefficients, Aluminum, Heat flux, Pins (Engineering), Temperature
Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Paper No: IPACK2005-73228
DOI: https://doi.org/10.1115/IPACK2005-73228
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes
Proceedings Papers

Thermal Performance of Thermally Enhanced PBGA Packages

Sriram Neelakantan, Bennett Joiner
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 451-459, July 17–22, 2005
Paper No: IPACK2005-73303
DOI: https://doi.org/10.1115/IPACK2005-73303
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Topics: Ball-Grid-Array packaging, Clearances (Engineering), Computational fluid dynamics, Copper, Electrical conductivity, Finite element analysis, Heat, Heat sinks, Metals, Mixed convection
Proceedings Papers

Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages

Desmond Y. R. Chong, C. K. Wang, K. C. Fong, Pradeep Lall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 933-939, July 6–11, 2003
Paper No: IPACK2003-35335
DOI: https://doi.org/10.1115/IPACK2003-35335
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Topics: Ball-Grid-Array packaging, Finite element analysis, Stress, Warping, Failure, Clearances (Engineering), Cracking (Materials), Fracture (Materials), Fracture (Process), Integrated circuits
Proceedings Papers

Experiments and Modeling of the Hydraulic Resistance of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

Mario Urdaneta, Alfonso Ortega, Russel V. Westphal
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 587-596, July 6–11, 2003
Paper No: IPACK2003-35268
DOI: https://doi.org/10.1115/IPACK2003-35268
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Topics: Flow (Dynamics), Heat sinks, Modeling, Pins (Engineering), Aluminum, Pressure, Clearances (Engineering), Dimensions, Pressure drop, Pressure measurement