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Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Paper No: IPACK2021-73269
DOI: https://doi.org/10.1115/IPACK2021-73269
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Topics: Compression, Cooling, Data centers, Heat recovery, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Paper No: IPACK2021-73270
DOI: https://doi.org/10.1115/IPACK2021-73270
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Topics: Compression, Condensers (steam plant), Cooling, Heat recovery, Modeling, Thermal management, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Paper No: IPACK2021-73271
DOI: https://doi.org/10.1115/IPACK2021-73271
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Topics: Compression, Compressors, Cooling, Heat recovery, Modeling, Thermal management, Vapors
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Paper No: IPACK2019-6507
DOI: https://doi.org/10.1115/IPACK2019-6507
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
DOI: https://doi.org/10.1115/IPACK2019-6389
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Paper No: IPACK2015-48638
DOI: https://doi.org/10.1115/IPACK2015-48638
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Paper No: IPACK2015-48814
DOI: https://doi.org/10.1115/IPACK2015-48814
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Paper No: IPACK2015-48516
DOI: https://doi.org/10.1115/IPACK2015-48516
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A005, July 6–9, 2015
Paper No: IPACK2015-48381
DOI: https://doi.org/10.1115/IPACK2015-48381
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Topics: Piezoelectric materials, Density, Displacement, Stress, Stress singularity, Compression, Corners (Structural elements)
Proceedings Papers

Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

Satoru Mizuno, Tamio Ida, Manabu Fuchihata, Edmundo Sanchez, Jr., Koji Yoshikuni
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A004, July 6–9, 2015
Paper No: IPACK2015-48767
DOI: https://doi.org/10.1115/IPACK2015-48767
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Topics: Biomass, Coke, Compressive strength, Density, Compression, High temperature, Temperature, Water, Coal, Fibers
Proceedings Papers

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Ah-Young Park, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Paper No: IPACK2013-73280
DOI: https://doi.org/10.1115/IPACK2013-73280
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Topics: Compression, Copper, Finite element methods, Fracture mechanics, Bonding, Fracture (Materials), Solders, Density, Joining, Temperature
Proceedings Papers

Impact of Material Properties on Cooling COP of Integrated Thermoelectric Microcoolers

Yee Rui Koh, Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A036, July 16–18, 2013
Paper No: IPACK2013-73184
DOI: https://doi.org/10.1115/IPACK2013-73184
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Topics: Cooling, Materials properties, Microcoolers, Thermal conductivity, Compression, Cycles, Electrical conductivity, Energy consumption, Energy efficiency, Heat
Proceedings Papers

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A007, July 16–18, 2013
Paper No: IPACK2013-73050
DOI: https://doi.org/10.1115/IPACK2013-73050
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Topics: Compression, Lasers, Thermoreflectance, Electrons, Temperature, Computer simulation, Density, Reflectance, Thermal analysis
Proceedings Papers

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

Vikram Venkatadri, Mark Downey, Xiaojie Xue, Dipak Sengupta, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 723-731, July 6–8, 2011
Paper No: IPACK2011-52143
DOI: https://doi.org/10.1115/IPACK2011-52143
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Topics: Bonding, Compression, Design, Finite element analysis
Proceedings Papers

Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors

Benjamin Lemke, Oliver Paul, Shankar Ganapathysubramanian, Patrick Nardi, Rajashree Baskaran
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 35-44, July 6–8, 2011
Paper No: IPACK2011-52124
DOI: https://doi.org/10.1115/IPACK2011-52124
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Topics: Complementary metal oxide semiconductors, Flip-chip, Resolution (Optics), Sensors, Stress, Compression, Shear (Mechanics), Computer simulation, Shear stress, Adhesion
Proceedings Papers

Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling

Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 399-408, July 19–23, 2009
Paper No: InterPACK2009-89162
DOI: https://doi.org/10.1115/InterPACK2009-89162
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Topics: Compression, Computer cooling, Refrigeration, Vapors, Compressors, Cooling, Heat, Heat exchangers, Porous materials, Transients (Dynamics)
Proceedings Papers

Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays

Xuejiao Hu, Lawrence S. Pan, Gang Gu, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 597-603, July 19–23, 2009
Paper No: InterPACK2009-89375
DOI: https://doi.org/10.1115/InterPACK2009-89375
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Topics: Carbon nanotubes, Thermal resistance, Compression, Mechanical properties, Metals, Microscopy, Solders, Thermal conductivity
Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009
Paper No: InterPACK2009-89258
DOI: https://doi.org/10.1115/InterPACK2009-89258
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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants
Proceedings Papers

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Velimir Jovanovic, Saeid Ghamaty, Daniel Krommenhoek, John C. Bass
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 595-601, July 8–12, 2007
Paper No: IPACK2007-33838
DOI: https://doi.org/10.1115/IPACK2007-33838
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Topics: Quantum wells, Cooling, Sensors, Temperature, National Institute of Standards and Technology, Thin films, Air conditioning, Compression, Compressors, Cooling systems