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Proceedings Papers

Boiling Limit on Textured Oil-Impregnated Surfaces

Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
https://doi.org/10.1115/IPACK2023-111736
View Paper titled, Boiling Limit on Textured Oil-Impregnated Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Pool boiling, Thermal management, Vapors, Heat, Copper, Delays, Failure
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
https://doi.org/10.1115/IPACK2019-6417
View Paper titled, Thermal Analysis of 3D ICs With TSVs Placement Optimization
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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48533
https://doi.org/10.1115/IPACK2015-48533
View Paper titled, Multi-Physics Driven Co-Design of 3D Multicore Architectures
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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yogendra Joshi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73080
https://doi.org/10.1115/IPACK2013-73080
View Paper titled, Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
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Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature
Proceedings Papers

Development of a Hybrid PCM-Air Heat Sink

Y. Kozak, B. Abramzon, G. Ziskind
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 173-178, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52097
https://doi.org/10.1115/IPACK2011-52097
View Paper titled, Development of a Hybrid PCM-Air Heat Sink
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Topics: Heat sinks, Temperature, Heat, Melting, Energy dissipation, Phase change materials, Thermal management, Aluminum, Cooling, Delays
Proceedings Papers

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

Sandeep Sane, Shalabh Tandon, Biju Chandran, Tsgereda Alazar, Leonard R. Sorenson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 965-969, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73306
https://doi.org/10.1115/IPACK2005-73306
View Paper titled, On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques
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Topics: Shear (Mechanics), Silicon, Manufacturing, Failure mechanisms, Stress, Failure, Reliability, Calibration, Delays, Failure analysis
Proceedings Papers

Electrical Simulation Design Technology of Silicon Through Substrate

Takamasa Takano, Masataka Yamaguchi, Koichi Nakayama, Tomoko Maruyama, Shigeki Chujyo, Satoru Kuramochi, Yoshitaka Fukuoka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 999-1004, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73339
https://doi.org/10.1115/IPACK2005-73339
View Paper titled, Electrical Simulation Design Technology of Silicon Through Substrate
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Topics: Design, Silicon, Simulation, Packaging, System-in-package, Transmission lines, Cables, Circuits, Clocks, Delays