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Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021

Paper No: IPACK2021-74016

DOI: https://doi.org/10.1115/IPACK2021-74016

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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)

Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018

Paper No: IPACK2018-8422

DOI: https://doi.org/10.1115/IPACK2018-8422

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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers

Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017

Paper No: IPACK2017-74339

DOI: https://doi.org/10.1115/IPACK2017-74339

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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)

Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017

Paper No: IPACK2017-74108

DOI: https://doi.org/10.1115/IPACK2017-74108

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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning

Proceedings Papers

Monitoring Fugitive Methane Gas Emission From Natural Gas Pads

Levente J. Klein, Ted van Kessel, Dhruv Nair, Ramachandran Muralidhar, Hendrik Hamann, Norma Sosa

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 29–September 1, 2017

Paper No: IPACK2017-74191

DOI: https://doi.org/10.1115/IPACK2017-74191

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Topics: Emissions, Methane, Natural gas, Leakage, Sensors, Plumes (Fluid dynamics), Governments, Maintenance, Regulations, Wind

Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi

Paper No: IPACK2017-74158

DOI: https://doi.org/10.1115/IPACK2017-74158

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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics

Proceedings Papers

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia

Paper No: IPACK2017-74174

DOI: https://doi.org/10.1115/IPACK2017-74174

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Topics: Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Cooling, Fans, High temperature, Leakage

Proceedings Papers

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Fanghao Yang, Xiaochuan Li, Wenming Li, Chen Li

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015

Paper No: IPACK2015-48737

DOI: https://doi.org/10.1115/IPACK2015-48737

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanostructures , Fluids, Heat sinks, Nanolithography, Nanoparticles, Nanoscale phenomena

Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015

Paper No: IPACK2015-48237

DOI: https://doi.org/10.1115/IPACK2015-48237

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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics

Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015

Paper No: IPACK2015-48244

DOI: https://doi.org/10.1115/IPACK2015-48244

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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics

Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015

Paper No: IPACK2015-48432

DOI: https://doi.org/10.1115/IPACK2015-48432

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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage

Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015

Paper No: IPACK2015-48533

DOI: https://doi.org/10.1115/IPACK2015-48533

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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux

Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015

Paper No: IPACK2015-48640

DOI: https://doi.org/10.1115/IPACK2015-48640

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Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards

Proceedings Papers

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015

Paper No: IPACK2015-48017

DOI: https://doi.org/10.1115/IPACK2015-48017

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Topics: Design, Manufacturing, Micropumps, Flow (Dynamics), Blades, Computational fluid dynamics, Emissions, Impellers, Pressure, Pumps

Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015

Paper No: IPACK2015-48154

DOI: https://doi.org/10.1115/IPACK2015-48154

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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors

Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee

Paper No: IPACK2015-48814

DOI: https://doi.org/10.1115/IPACK2015-48814

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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities

Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013

Paper No: IPACK2013-73216

DOI: https://doi.org/10.1115/IPACK2013-73216

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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics

Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013

Paper No: IPACK2013-73028

DOI: https://doi.org/10.1115/IPACK2013-73028

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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design

Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013

Paper No: IPACK2013-73214

DOI: https://doi.org/10.1115/IPACK2013-73214

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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement

Proceedings Papers

Compact Modeling of Data Center Air Containment Systems

Xuanhang (Simon) Zhang, James W. VanGilder, Christopher M. Healey, Zachary R. Sheffer

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A026, July 16–18, 2013

Paper No: IPACK2013-73325

DOI: https://doi.org/10.1115/IPACK2013-73325

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Topics: Containment systems, Data centers, Modeling, Leakage, Computer simulation, Flow (Dynamics), Ceilings, Computational fluid dynamics, Air flow, Cooling

NARROW

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Monitoring Fugitive Methane Gas Emission From Natural Gas Pads

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Failure Analysis of Direct Liquid Cooling System in Data Centers

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Development of a Raised-Floor Plenum Design Tool

Multi-Physics Driven Co-Design of 3D Multicore Architectures

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Design, Fabrication and Characterization of a Mechanical Micropump

Measuring Moisture Leakage Out of Water Cooling Hardware

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Compact Modeling of Data Center Air Containment Systems

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