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Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Paper No: IPACK2021-73253
DOI: https://doi.org/10.1115/IPACK2021-73253
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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Paper No: IPACK2021-69270
DOI: https://doi.org/10.1115/IPACK2021-69270
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Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Paper No: IPACK2020-2648
DOI: https://doi.org/10.1115/IPACK2020-2648
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Paper No: IPACK2020-2524
DOI: https://doi.org/10.1115/IPACK2020-2524
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
DOI: https://doi.org/10.1115/IPACK2020-2528
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
DOI: https://doi.org/10.1115/IPACK2020-2603
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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects

Tumininu Olatunji, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
DOI: https://doi.org/10.1115/IPACK2020-2596
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Topics: Additive manufacturing, Design, Electronic packaging, Manufacturing, Reliability, Solder joints
Proceedings Papers

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 7–9, 2019
Paper No: IPACK2019-6381
DOI: https://doi.org/10.1115/IPACK2019-6381
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Topics: Design, Electronic packaging, Stress, Temperature, Finite element analysis, Army, Design engineering, Flat heat pipes, Heat sinks, Manufacturing
Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Paper No: IPACK2019-6356
DOI: https://doi.org/10.1115/IPACK2019-6356
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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
DOI: https://doi.org/10.1115/IPACK2019-6391
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
DOI: https://doi.org/10.1115/IPACK2019-6442
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Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Paper No: IPACK2019-6354
DOI: https://doi.org/10.1115/IPACK2019-6354
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Paper No: IPACK2019-6569
DOI: https://doi.org/10.1115/IPACK2019-6569
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Paper No: IPACK2019-6514
DOI: https://doi.org/10.1115/IPACK2019-6514
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Paper No: IPACK2019-6424
DOI: https://doi.org/10.1115/IPACK2019-6424
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration

Guo Xiaochuan
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 27–30, 2018
Paper No: IPACK2018-8214
DOI: https://doi.org/10.1115/IPACK2018-8214
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Topics: Airbags, Printed circuit boards, Stress, Vibration, Design, Simulation, Simulation models, Finite element analysis, Manufacturing, Plate theory
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
DOI: https://doi.org/10.1115/IPACK2018-8345
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability