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Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Paper No: IPACK2021-73100
DOI: https://doi.org/10.1115/IPACK2021-73100
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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 7–9, 2019
Paper No: IPACK2019-6423
DOI: https://doi.org/10.1115/IPACK2019-6423
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Topics: Motors, Permanent magnets, Stators, Electric propulsion, Emissions, Maintenance, Winding (process), Damage, Flaw detection, Mechanical admittance
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Bin Xiang, Lei Yang, Jian Huang, Qi Fu
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A001, July 6–9, 2015
Paper No: IPACK2015-48286
DOI: https://doi.org/10.1115/IPACK2015-48286
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Topics: Atomic force microscopy, Chemical vapor deposition, Electronics, Emergencies, Mechanical admittance, Optoelectronic devices, Photoluminescence, Pressure, Raman spectroscopy, Resolution (Optics)
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Paper No: IPACK2013-73324
DOI: https://doi.org/10.1115/IPACK2013-73324
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Effect of TSV Joule Heating on Device Performance

Fahad Mirza, Gaurang Naware, Thiagarajan Raman, Ankur Jain, Dereje Agonafer
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A016, July 16–18, 2013
Paper No: IPACK2013-73228
DOI: https://doi.org/10.1115/IPACK2013-73228
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Topics: Electrical conductance, Heating, Joules, Mechanical admittance
Proceedings Papers

Nodal Topology in Compact Thermal Models

D. H. Greisen, V. P. Manno
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 637-643, July 8–12, 2007
Paper No: IPACK2007-33425
DOI: https://doi.org/10.1115/IPACK2007-33425
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Topics: Ball-Grid-Array packages, Boundary-value problems, Design, Electronic packages, Errors, Heat flux, Heat transfer coefficients, Mechanical admittance, Topology
Proceedings Papers

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 297-307, July 8–12, 2007
Paper No: IPACK2007-33570
DOI: https://doi.org/10.1115/IPACK2007-33570
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Topics: Calibration, Hydrostatics, Silicon, Stress, Sensors, Temperature, Pressure, Electrical resistivity, Experimental methods, Manufacturing