1-20 of 22
Safety
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
Open the PDF for Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model in another window
Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73100
https://doi.org/10.1115/IPACK2021-73100
View Paper titled, Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
Open the PDF for Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading in another window
Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74066
https://doi.org/10.1115/IPACK2021-74066
View Paper titled, Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning
Open the PDF for Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning in another window
Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Open the PDF for Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging in another window
Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
Open the PDF for System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application in another window
Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
https://doi.org/10.1115/IPACK2019-6434
View Paper titled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
Open the PDF for Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger in another window
Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8356
https://doi.org/10.1115/IPACK2018-8356
View Paper titled, Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration
Open the PDF for Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration in another window
Topics: Damage assessment, Electronics, Temperature, Vibration, Damage, Failure, Signals, Safety, High temperature, Principal component analysis
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8386
https://doi.org/10.1115/IPACK2018-8386
View Paper titled, Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
Open the PDF for Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems in another window
Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74233
https://doi.org/10.1115/IPACK2017-74233
View Paper titled, Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
Open the PDF for Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments in another window
Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74224
https://doi.org/10.1115/IPACK2017-74224
View Paper titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74208
https://doi.org/10.1115/IPACK2017-74208
View Paper titled, Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Open the PDF for Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches in another window
Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48288
https://doi.org/10.1115/IPACK2015-48288
View Paper titled, Passive Thermosyphon Cooling System for High Heat Flux Servers
Open the PDF for Passive Thermosyphon Cooling System for High Heat Flux Servers in another window
Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

Thermal Evaluation Process on Smart Watches

Angel Qian Han, Nanbo Kang
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A032, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48711
https://doi.org/10.1115/IPACK2015-48711
View Paper titled, Thermal Evaluation Process on Smart Watches
Open the PDF for Thermal Evaluation Process on Smart Watches in another window
Topics: Battery life, Computer software, Design, Safety, Security, Simulation
Proceedings Papers

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Fanghao Yang, Xiaochuan Li, Wenming Li, Chen Li
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48737
https://doi.org/10.1115/IPACK2015-48737
View Paper titled, Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000
Open the PDF for Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000 in another window
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanostructures , Fluids, Heat sinks, Nanolithography, Nanoparticles, Nanoscale phenomena
Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48593
https://doi.org/10.1115/IPACK2015-48593
View Paper titled, Discrete Control of Air Conditioning Units in Mission Critical Facilities
Open the PDF for Discrete Control of Air Conditioning Units in Mission Critical Facilities in another window
Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety
Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48015
https://doi.org/10.1115/IPACK2015-48015
View Paper titled, Key Technologies to Implement High Thermal Ambient Data Center
Open the PDF for Key Technologies to Implement High Thermal Ambient Data Center in another window
Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73245
https://doi.org/10.1115/IPACK2013-73245
View Paper titled, A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
Open the PDF for A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration in another window
Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Design of Simulated Server Racks for Data Center Research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52016
https://doi.org/10.1115/IPACK2011-52016
View Paper titled, Design of Simulated Server Racks for Data Center Research
Open the PDF for Design of Simulated Server Racks for Data Center Research in another window
Topics: Data centers, Design, Server racks, Computers, Fans, Heating, Temperature, Density, Flow (Dynamics), Pressure drop
Proceedings Papers

Multiphysics Approach to Modeling Supercapacitors for Improving Performance

Xinqiang Xu, Bahgat G. Sammakia, DaeYoung Jung, Thor Eilertsen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 165-174, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52081
https://doi.org/10.1115/IPACK2011-52081
View Paper titled, Multiphysics Approach to Modeling Supercapacitors for Improving Performance
Open the PDF for Multiphysics Approach to Modeling Supercapacitors for Improving Performance in another window
Topics: Modeling, Ultracapacitors, Heat, Electrolytes, Temperature, Temperature distribution, Thermal management, Activated carbon, Boundary-value problems, Computer software
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
Open the PDF for System Level Thermal Design Challenges in Validation Platforms in another window
Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating