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Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Paper No: IPACK2021-66842
DOI: https://doi.org/10.1115/IPACK2021-66842
View Paper titled, Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
Click here to open pdf in another window PDF for Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Paper No: IPACK2021-74062
DOI: https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Click here to open pdf in another window PDF for Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Paper No: IPACK2021-72612
DOI: https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
Click here to open pdf in another window PDF for Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Paper No: IPACK2020-2516
DOI: https://doi.org/10.1115/IPACK2020-2516
View Paper titled, Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules
Click here to open pdf in another window PDF for Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules
Topics: Energy gap, Heat sinks, Optimization, Cooling, Heat, Energy conversion, Power semiconductor devices, Reliability, Semiconductor devices, Steady state
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
DOI: https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
Click here to open pdf in another window PDF for Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Paper No: IPACK2019-6436
DOI: https://doi.org/10.1115/IPACK2019-6436
View Paper titled, Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
Click here to open pdf in another window PDF for Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Paper No: IPACK2019-6416
DOI: https://doi.org/10.1115/IPACK2019-6416
View Paper titled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Click here to open pdf in another window PDF for Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
DOI: https://doi.org/10.1115/IPACK2018-8448
View Paper titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger
Click here to open pdf in another window PDF for Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger
Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
DOI: https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
Click here to open pdf in another window PDF for Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
DOI: https://doi.org/10.1115/IPACK2017-74108
View Paper titled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 29–September 1, 2017
Paper No: IPACK2017-74015
DOI: https://doi.org/10.1115/IPACK2017-74015
View Paper titled, Transient and Steady State Thermal Response of a System With Thermoelectric Coolers
Click here to open pdf in another window PDF for Transient and Steady State Thermal Response of a System With Thermoelectric Coolers
Topics: Steady state, Thermoelectric coolers, Transients (Dynamics), Thermal resistance, Eigenfunctions, Eigenvalues, Insulation, Thermal systems
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Paper No: IPACK2015-48516
DOI: https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
Click here to open pdf in another window PDF for Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal

Subhasis Mukherjee, Bite Zhou, Abhijit Dasgupta, Thomas R. Bieler
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A006, July 6–9, 2015
Paper No: IPACK2015-48710
DOI: https://doi.org/10.1115/IPACK2015-48710
View Paper titled, Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal
Click here to open pdf in another window PDF for Mechanistic Modeling of the Anisotropic Steady State Creep Response of SnAgCu Single Crystal
Topics: Anisotropy, Creep, Crystals, Modeling, Steady state, Tin, Dislocations, Stress, Dislocation density, Nanoscale phenomena
Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015
Paper No: IPACK2015-48257
DOI: https://doi.org/10.1115/IPACK2015-48257
View Paper titled, An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
Click here to open pdf in another window PDF for An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions
Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Paper No: IPACK2015-48237
DOI: https://doi.org/10.1115/IPACK2015-48237
View Paper titled, Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves
Click here to open pdf in another window PDF for Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves
Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics
Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Paper No: IPACK2015-48377
DOI: https://doi.org/10.1115/IPACK2015-48377
View Paper titled, Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems
Click here to open pdf in another window PDF for Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems
Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers
Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Paper No: IPACK2015-48770
DOI: https://doi.org/10.1115/IPACK2015-48770
View Paper titled, Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
Click here to open pdf in another window PDF for Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design
Proceedings Papers

Experimental Investigation of Fluid Motion in Pulsating Heat Pipe

Hyung Yun Noh, Sung Jin Kim
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A054, July 6–9, 2015
Paper No: IPACK2015-48285
DOI: https://doi.org/10.1115/IPACK2015-48285
View Paper titled, Experimental Investigation of Fluid Motion in Pulsating Heat Pipe
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Topics: Fluids, Heat pipes, Pressure, Heat transfer, Latent heat, Temperature, Equilibrium (Physics), Flow visualization, Heat, Pressure sensors
Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yogendra Joshi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Paper No: IPACK2013-73080
DOI: https://doi.org/10.1115/IPACK2013-73080
View Paper titled, Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
Click here to open pdf in another window PDF for Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature