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Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Paper No: IPACK2015-48234
https://doi.org/10.1115/IPACK2015-48234
View Paper titled, Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Pressure, Tiles, Boundary-value problems, Cooling, Dimensions, Ducts
Proceedings Papers

A Data Center Environmental Advisory System

Christopher Hoover, Niru Kumari, Carlos Felix, Cullen Bash
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 511-517, July 6–8, 2011
Paper No: IPACK2011-52128
https://doi.org/10.1115/IPACK2011-52128
View Paper titled, A Data Center Environmental Advisory System
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Topics: Data centers, Cooling, Air conditioners, Computers, Geometry, Stress, Temperature, Tiles, Vents
Proceedings Papers

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 479-490, July 19–23, 2009
Paper No: InterPACK2009-89219
https://doi.org/10.1115/InterPACK2009-89219
View Paper titled, Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling
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Topics: Computer cooling, Porosity, Vents, Flow (Dynamics), Cooling, Density, Fans, Pressure
Proceedings Papers

Autonomous Detection of Thermal Anomalies in Data Centers

Manish Marwah, Ratnesh K. Sharma, Wilfredo Lugo
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 777-783, July 19–23, 2009
Paper No: InterPACK2009-89140
https://doi.org/10.1115/InterPACK2009-89140
View Paper titled, Autonomous Detection of Thermal Anomalies in Data Centers
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Topics: Data centers, Cooling, Sensors, Temperature, Temperature sensors, Actuators, Air conditioning, Computers, Cooling towers, Energy consumption
Proceedings Papers

Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger

Milnes P. David, Julie Steinbrenner, Josef Miler, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 437-444, July 19–23, 2009
Paper No: InterPACK2009-89192
https://doi.org/10.1115/InterPACK2009-89192
View Paper titled, Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
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Topics: Copper, Heat exchangers, Microchannels, Visualization, Flow (Dynamics), Membranes, Vapors, Pressure, Air flow, Cooling
Proceedings Papers

Local Cooling Control of Data Centers With Adaptive Vent Tiles

Monem H. Beitelmal, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Alan McReynolds
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 645-652, July 19–23, 2009
Paper No: InterPACK2009-89035
https://doi.org/10.1115/InterPACK2009-89035
View Paper titled, Local Cooling Control of Data Centers With Adaptive Vent Tiles
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Topics: Cooling, Data centers, Tiles, Vents, Control equipment, Air flow, Algorithms, Design, Dynamic models, Errors
Proceedings Papers

Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

John R. Hartenstine, Richard W. Bonner, III, Jared R. Montgomery, Tadej Semenic
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 715-722, July 8–12, 2007
Paper No: IPACK2007-33993
https://doi.org/10.1115/IPACK2007-33993
View Paper titled, Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources
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Topics: Composite materials, Cooling, Copper, Design, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Slabs
Proceedings Papers

Tactile Temperature Analysis of Home Theater System

Ho Chul Ryu, Byung Ju Dan, In Ho Choi, Jin Yong Kim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 477-482, July 17–22, 2005
Paper No: IPACK2005-73334
https://doi.org/10.1115/IPACK2005-73334
View Paper titled, Tactile Temperature Analysis of Home Theater System
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Topics: Computational fluid dynamics, Temperature, Vents
Proceedings Papers

Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design

Madhusudan Iyengar, Michael J. Ellsworth, Jr., Robert E. Simons, Levi A. Campbell
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 527-533, July 17–22, 2005
Paper No: IPACK2005-73386
https://doi.org/10.1115/IPACK2005-73386
View Paper titled, Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design
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Topics: Computer simulation, Convection, Design, Heat conduction, Jets, Density, Heat transfer coefficients, Computational fluid dynamics, Cooling, Errors