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Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A021, July 6–9, 2015
Paper No: IPACK2015-48375
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Paper No: IPACK2015-48024
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A072, July 6–9, 2015
Paper No: IPACK2015-48146
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A052, July 16–18, 2013
Paper No: IPACK2013-73286
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 1-6, July 6–8, 2011
Paper No: IPACK2011-52011
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 203-212, July 6–8, 2011
Paper No: IPACK2011-52121
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 509-513, July 8–12, 2007
Paper No: IPACK2007-33871
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Paper No: IPACK2005-73011
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 393-400, July 17–22, 2005
Paper No: IPACK2005-73272
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 291-298, July 17–22, 2005
Paper No: IPACK2005-73222
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Paper No: IPACK2005-73228
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 317-321, July 6–11, 2003
Paper No: IPACK2003-35141