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Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Paper No: IPACK2015-48237
https://doi.org/10.1115/IPACK2015-48237
View Paper titled, Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves
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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Paper No: IPACK2015-48019
https://doi.org/10.1115/IPACK2015-48019
View Paper titled, Hot Spot Elimination by Thin and Smart Heat Spreader
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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis
Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Paper No: IPACK2015-48593
https://doi.org/10.1115/IPACK2015-48593
View Paper titled, Discrete Control of Air Conditioning Units in Mission Critical Facilities
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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety
Proceedings Papers

Data Center Cooling Efficiency With Simulation-Based Optimization

Laurent M. Billet, Christopher M. Healey, James W. VanGilder, Zachary M. Pardey
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A025, July 6–9, 2015
Paper No: IPACK2015-48425
https://doi.org/10.1115/IPACK2015-48425
View Paper titled, Data Center Cooling Efficiency With Simulation-Based Optimization
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Topics: Cooling, Data centers, Optimization, Simulation, Energy consumption, Air flow, Cooling systems, Pressure, Sensors, Temperature
Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015
Paper No: IPACK2015-48085
https://doi.org/10.1115/IPACK2015-48085
View Paper titled, A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System
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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation
Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015
Paper No: IPACK2015-48753
https://doi.org/10.1115/IPACK2015-48753
View Paper titled, Unsteady Heat Flux Measurements in Agitated Channel Flows
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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Paper No: IPACK2015-48244
https://doi.org/10.1115/IPACK2015-48244
View Paper titled, Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015
Paper No: IPACK2015-48303
https://doi.org/10.1115/IPACK2015-48303
View Paper titled, The Detection of Minimum BLT Condition With Electrical Capacitance Measurement
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Topics: Capacitance, Heat, Fillers (Materials), Heat sinks, Solids, Electrical measurement, Mass production, Pressure, Semiconductor devices, Silicones
Proceedings Papers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

Ah-Young Park, S. B. Park
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A066, July 6–9, 2015
Paper No: IPACK2015-48042
https://doi.org/10.1115/IPACK2015-48042
View Paper titled, Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding
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Topics: Bonding, Design, Thermal management, Finite element analysis, Packaging, Solders, Dimensions, Energy consumption, Heat transfer, Integrated circuits
Proceedings Papers

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

Hsien-Chin Su
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A002, July 6–9, 2015
Paper No: IPACK2015-48151
https://doi.org/10.1115/IPACK2015-48151
View Paper titled, A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force
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Topics: Cooling systems, Electromagnetic force, Cooling, Blades, Dimensions, Electromagnets, Bearings, Design, Energy consumption, Engines
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Paper No: IPACK2015-48051
https://doi.org/10.1115/IPACK2015-48051
View Paper titled, Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Neural Network Modeling in Model-Based Control of a Data Center

Nachiket Kansara, Rohit Katti, Kourosh Nemati, Alan P. Bowling, Bahgat Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A034, July 6–9, 2015
Paper No: IPACK2015-48684
https://doi.org/10.1115/IPACK2015-48684
View Paper titled, Neural Network Modeling in Model-Based Control of a Data Center
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Topics: Artificial neural networks, Data centers, Modeling, Computational fluid dynamics, Temperature, Neural network models, Sensors, Storage, Transients (Dynamics)
Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Paper No: IPACK2015-48274
https://doi.org/10.1115/IPACK2015-48274
View Paper titled, Theoretical and Empirical Energy Impacts of Economization in Data Centers
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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring
Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Paper No: IPACK2015-48430
https://doi.org/10.1115/IPACK2015-48430
View Paper titled, Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption
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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure
Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Paper No: IPACK2015-48015
https://doi.org/10.1115/IPACK2015-48015
View Paper titled, Key Technologies to Implement High Thermal Ambient Data Center
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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Paper No: IPACK2015-48685
https://doi.org/10.1115/IPACK2015-48685
View Paper titled, Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods
Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015
Paper No: IPACK2015-48258
https://doi.org/10.1115/IPACK2015-48258
View Paper titled, Rack Server Solution in Data Center
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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat