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Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Paper No: IPACK2021-69270
...]. (AlN) has excellent thermal and electrical properties with copper currently being bonded to AlN via a direct bond copper (DBC) The high thermal conductivity (70 200 W/m-K) and large technique. However, substrates fabricated by DBC are subjected bandgap of aluminum nitride (AlN) (~6.1 eV) allows...