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Keywords: Au
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Paper No: IPACK2020-2533
...Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers Keywords: Gold, Tin, Au, Sn, bonding, eutectic, flip-chip, Kirkendall voids, overflow, reflow, intermetallic, dendrites ABSTRACT In this study...