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Keywords: Electronic PackagingClose
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
...ADDITIVE FABRICATED COMPLIANT INTERCONNECTS: DESIGN, FABRICATION AND RELIABILITY EFFECTS Tumininu Olatunji Mechanical Engineering University of Arkansas Fayetteville, AR, USA David Huitink, Ph.D. 1 Mechanical Engineering University of Arkansas Fayetteville, AR, USA ABSTRACT Electronics packaging...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 827-833, July 17–22, 2005
Paper No: IPACK2005-73026
... of electronic units used in military systems. Mechanical Design Electronic Packaging Electronic Assembly Military Systems Commercial Off-The-Shelf (COTS) Proceedings of IPACK2005 ASME InterPACK '05 performance parameters of semiconductor packaging technologies such as memories, processors...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Paper No: IPACK2005-73296
..., feasible, reliable and chipping-free tests for silicon dies of dummy or real IC chips, without strict geometrical limitation, such as beam-type geometry for three-point or four-point bending test. Electronic packaging Die strength Test method Failure mode Point loading Four-point bending Wafer...