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Keywords: Electronic Packaging
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Proceedings Papers

Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects

Tumininu Olatunji, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
DOI: https://doi.org/10.1115/IPACK2020-2596
...ADDITIVE FABRICATED COMPLIANT INTERCONNECTS: DESIGN, FABRICATION AND RELIABILITY EFFECTS Tumininu Olatunji Mechanical Engineering University of Arkansas Fayetteville, AR, USA David Huitink, Ph.D. 1 Mechanical Engineering University of Arkansas Fayetteville, AR, USA ABSTRACT Electronics packaging...
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Topics: Additive manufacturing, Design, Electronic packaging, Manufacturing, Reliability, Solder joints
Proceedings Papers

Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems

Medy Ramot
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 827-833, July 17–22, 2005
Paper No: IPACK2005-73026
DOI: https://doi.org/10.1115/IPACK2005-73026
... of electronic units used in military systems. Mechanical Design Electronic Packaging Electronic Assembly Military Systems Commercial Off-The-Shelf (COTS) Proceedings of IPACK2005 ASME InterPACK '05 performance parameters of semiconductor packaging technologies such as memories, processors...
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Topics: Design engineering, Manufacturing, Military systems
Proceedings Papers

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Paper No: IPACK2005-73296
DOI: https://doi.org/10.1115/IPACK2005-73296
..., feasible, reliable and chipping-free tests for silicon dies of dummy or real IC chips, without strict geometrical limitation, such as beam-type geometry for three-point or four-point bending test. Electronic packaging Die strength Test method Failure mode Point loading Four-point bending Wafer...
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Topics: Atomic force microscopy, Design, Electromagnetic scattering, Electronic packaging, Failure, Failure mechanisms, Finite element analysis, Geometry, Grinding, Packaging