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Keywords: FO-MCM
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
... width/line space of 1/1um and introduce the related process challenge, microstructure data. Keywords: FO-MCM, RDL, Warpage 1. INTRODUCTION For more than a decade, the semiconductor IC industry has developed with the evolution of the wafer manufacturing process. The number of transistors in a single chip...