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Keywords: additive printing
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
... Abstract Additively printed thermoformable circuitry for In-Mold Electronics (IME) is getting tremendous research focus because of its numerous advantages: design flexibility, cost-effectiveness, weight reduction, and potential for seamless integration into structural components. This study...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
... of the repair procedure on the circuit’s electrical performance. flexible electronics direct-write additive printing surface mount device electrically conductive adhesive Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
... Abstract Throughout the past decade, the field of printed electronics has gained increased research impetus and has started to make entryways into the consumer electronics product market. The applications of additive printed electronics are numerous and range from healthcare devices and smart...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
... have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs. direct-write technique additive printing in-mold electronics flexible electronics PC silver ink...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
... motions. Micro dispensing equipment was employed in this investigation to print conductive traces, an electrically conductive adhesive (ECA), and low-temperature solder (LTS) for component attachment pads. There is little understanding of SMD attachments’ behavior on additively printed flexible substrates...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
... Abstract Developing component attachment techniques with low-temperature processing is required to implement flexible hybrid electronics utilizing additively printed circuits. Additive electronics may be made on several substrates such as Polyimide, PET, and PEN. While polyimide may...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
... Abstract The increased versatility in the design and manufacturing of components in low volumes, as well as the shorter time between design and prototype, has increased interest in the field of additively printed electronics. The ability to directly print on a variety of substrates, whether...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
... Abstract Filters are used in a variety of signal processing applications in commercial and defense electronics. The use of additively printed electronics in high-frequency applications requires an understanding of the process-performance interactions versus frequency of operation. Assembly...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2664
... Abstract Flexible electronics is a rapid emerging trend in consumer-electronics with ever-increasing applications showing feasibility of functionality with flexibility. Aerosol Jet printing technology has gained rapid acceptance for additive printing owing to non-contact deposition and ability...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6579
... Abstract Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various...