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Keywords: chip-to-substrate interconnects
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
...: Additive Manufacturing, Compliant Interconnects, Electronic packaging, Reliability, Solder joint fatigue, wafer-level packaging, chip-to-substrate interconnects. 1 Corresponding author: dhuitin@uark.edu NOMENCLATURE ABS Acrylonitrile Butadiene Styrene. AM Additive Manufactured/Manufacturing. C Mechanical...