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Keywords: data center
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 27–29, 2020
Paper No: IPACK2020-2592
...CFD ANALYSIS ON LIQUID COOLED COLD PLATE USING COPPER NANOPARTICLES Pardeep Shahi1, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer The University of Texas at Arlington Arlington, TX ABSTRACT In today s world, most data centers have multiple racks with numerous...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
... is studied for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 27–29, 2020
Paper No: IPACK2020-2590
...Abstract Abstract Modern-day data center administrators are finding it increasingly difficult to lower the costs incurred in mechanical cooling of their IT equipment. This is especially true for high-performance computing facilities like Artificial Intelligence, Bitcoin Mining, and Deep...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 7–9, 2019
Paper No: IPACK2019-6304
...Abstract Abstract Efficient cooling of data center infrastructure is an important way to reduce total energy consumption. Containment, with separation of hot and cold airflows has allowed significant increase in efficiencies. However, balancing the airflow, so that IT equipment in an aisle only...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 7–9, 2019
Paper No: IPACK2019-6309
...Abstract Abstract This study highlights experimental challenges of setting up a computational fluid dynamics (CFD) model of a 180-m 2 small-size high-performance computing (HPC) data center (DC) in a university campus and the validation procedure leading to a reasonably accurate CFD model...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A025, July 16–18, 2013
Paper No: IPACK2013-73298
... Reducing the energy consumption of a data center has recently become important because the data center market is rapidly expanding. We developed the “IT-facility linkage system” to deal with this energy saving requirement. This system reduces the amount of energy consumed in a data center...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 863-873, July 19–23, 2009
Paper No: InterPACK2009-89213
... in the water cooling system will also be described. Keywords: POWER6, water cooled, NCAR, rear door heat exchanger, data center, hydro cluster, Bluefire INTRODUCTION The increased performance required by such areas as life sciences (drug discovery, information based medicine), business intelligence, financial...
Topics: Design, Doors, Water
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 803-818, July 8–12, 2007
Paper No: IPACK2007-33507
... 12 01 2010 With the ever increasing heat dissipated by IT equipment housed in data centers it is becoming more important to project the changes that can occur in the data center as the newer higher powered hardware is installed. The computational fluid dynamics (CFD) software...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 215-224, July 17–22, 2005
Paper No: IPACK2005-73138
... 03 04 2009 Recent work has proposed an exergy-based strategy to achieve optimal system-wide performance via localized control of individual data center thermal management components. This paper presents the results of a case study where the proposed approach is applied to a data center...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1649-1659, July 17–22, 2005
Paper No: IPACK2005-73171
... 03 04 2009 Thermal management difficulties in data centers caused by the rapidly increasing power densities of modern computational equipment are compounded by the less frequent upgrading of the facilities themselves, creating a lifecycle mismatch. This paper utilizes the Proper...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 401-408, July 17–22, 2005
Paper No: IPACK2005-73273
... 03 04 2009 In raised-floor data centers, distributed leakage flow—the airflow through seams between panels on the raised floor—reduces the amount of cooling air available at the inlets of the computer equipment. This airflow must be known to determine the total cooling air requirement...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 663-673, July 17–22, 2005
Paper No: IPACK2005-73468
... and correspondingly increased air flowrate the chilled air flow supplied either through data center raised floor perforated tiles or diffusers for non raised floors is not sufficient to match the air flow required by the datacom racks. In this case some of the hot air exhausting the rear of a rack can return...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 205-213, July 17–22, 2005
Paper No: IPACK2005-73137
... 03 04 2009 As heat dissipation in data centers rises by orders of magnitude, inefficiencies such as recirculation will have an increasingly significant impact on the thermal manageability and energy efficiency of the cooling infrastructure. For example, prior work has shown...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 517-525, July 17–22, 2005
Paper No: IPACK2005-73385
... 03 04 2009 The heat dissipated by large servers and switching equipment is reaching levels that make it very difficult to cool these systems in data centers or telecommunications rooms. Some of the highest powered systems are dissipating upwards of 4000 watts/ft 2 (43,000 watts/m 2...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 535-543, July 17–22, 2005
Paper No: IPACK2005-73387
... 03 04 2009 Data center equipment almost always represents a high expenditure capital investment to the customer, and is often operated without any down time. Data com equipment is typically designed to operate at a rack air inlet temperature of between 10 and 35°C, and a violation...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 129-137, July 6–11, 2003
Paper No: IPACK2003-35059
... The data center of tomorrow is characterized as one containing a dense aggregation of commodity computing, networking and storage hardware mounted in industry standard racks. In fact, the data center is a computer. The walls of the data center are akin to the walls of the chassis in today’s...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 521-527, July 6–11, 2003
Paper No: IPACK2003-35297
...Proceedings of InterPACK 03 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui, Hawaii, USA o (CFD) modeling of data centers have been based around a simple rack m specified tempe solution to var needed to cool at the smaller larger...