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Keywords: data centers
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Paper No: IPACK2021-73269
... loop can be an economical solution to harness specific heat of air, J/(kg. K) waste heat recovery in data centers. Validated subsystem-level models of the thermosyphon cooling and recompression loops root diameter of the fin, m (evaporator, heat exchangers, compressor, etc.) are needed to tip diameter...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Paper No: IPACK2021-73270
... a commercial software. Keywords: Data centers, Electronics cooling, Liquid-cooling, Mathematical modeling, Modeling, Thermal management of electronics V001T02A013-1 Copyright © 2021 by ASME Greek has commissioned a set of regulations in 2019 in order to meet the goal of making Europe climate-neutral by 2050 [1...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Paper No: IPACK2021-73271
... for which data mechanical power, W may be limited, enabling component-level design or analysis for different operating conditions and system requirements. electromechanical power loss, W Keywords: Data centers, Electronics cooling, Liquid- generic model output parameter cooling, Mathematical modeling...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 605-612, July 6–11, 2003
Paper No: IPACK2003-35273
... Today’s data centers are designed for handling heat densities of 1000W/m 2 at the room level. Trends indicate that these heat densities will exceed 3000W/m 2 in the near future. As a result, cooling of data centers has emerged as an area of increasing importance in electronics thermal...