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Keywords: dielectric
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Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
... of the underlying electronics. Using z-axis interconnections with dielectric materials, which may allow or prevent the connection between two layers, is one method of reaching several layers of circuits. In this paper, a working multilayer circuitry test vehicle is designed and additively printed using the direct...
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components
Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2664
https://doi.org/10.1115/IPACK2020-2664
... printed using the ultrasonic atomizer and the interlayer dielectrics have been printed using the pneumatic atomizer. The effect of thermal sintering on the performance of the printed circuits has been quantified through measurements of interconnect resistance and shear load to failure. This paper explores...
View Paper titled, Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink
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Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress
Proceedings Papers

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2680
https://doi.org/10.1115/IPACK2020-2680
... of multiple vias has been compared to assess process consistency. aerosol jet multilayer micro-via dielectric sintering printed electronics PROCESS-CONSISTENCY IN ADDITIVE PRINTED MULTILAYER SUBSTRATES WITH OFFSET-VIAS USING AEROSOL JET TECHNOLOGY Pradeep Lall1, Kartik Goyal Auburn University...
View Paper titled, Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology
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Topics: Aerosols, Electronics, Sintering
Proceedings Papers

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Pradeep Lall, Kartik Goyal, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6574
https://doi.org/10.1115/IPACK2019-6574
... are developed. Importance of pre-cleaning the substrate is discussed, in addition to the printing process efficiency gauged as a function of process capability index and process capability ratio. aerosol jet multi-layer micro via dielectric process capability ratio and index regression model...
View Paper titled, Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry
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Topics: Aerosols, Printing
Proceedings Papers

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Sadegh Khalili, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6463
https://doi.org/10.1115/IPACK2019-6463
... technology (IT) load. two-phase cooling dielectric rack level cooling fluid distribution HFE 7000 heat exchanger load control AN EXPERIMENTAL INVESTIGATION ON THE FLUID DISTRIBUTION IN A TWO-PHASE COOLED RACK UNDER STEADY AND TRANSIENT IT LOAD Sadegh Khalili 1, Srikanth Rangarajan, Bahgat...
View Paper titled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load
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Topics: Cooling, Fluids, Stress, Transients (Dynamics)