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Keywords: low-temperature solderClose
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
...-write method. The circuit model involves conductive and dielectric ink printing, as well as passive and active component attachments using an electrically conductive adhesive (ECA) and low-temperature solder (LTS). The study also shows details about the process of developing dielectric printing...