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Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
...-write method. The circuit model involves conductive and dielectric ink printing, as well as passive and active component attachments using an electrically conductive adhesive (ECA) and low-temperature solder (LTS). The study also shows details about the process of developing dielectric printing...
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and <span class="search-highlight">Low</span>-<span class="search-highlight">Temperature</span> <span class="search-highlight">Solder</span> Material for Surface-Mount Component Attachment
Open the PDF for Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and <span class="search-highlight">Low</span>-<span class="search-highlight">Temperature</span> <span class="search-highlight">Solder</span> Material for Surface-Mount Component Attachment in another window
Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components