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Keywords: polyimide substrate
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
..., and we examined different aspects of their performance in this study. direct-write technique additive printing flexible electronics polyimide substrate copper neural network regression IMC Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
... parameters for microvias for multilayer z-axis interconnections. direct-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive low-temperature solder multilayer process development sintering analysis shear load to failure...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2664
..., Dielectric, Polyimide substrate, Additive printing, Resistance, Shear load to failure, Aerosol Jet Printing, Process study NOMENCLATURE Ag Silver NMP N-Methyl-2-Pyrrolidone AJP Aerosol Jet Printing 1 Contact author: lall@auburn.edu 1. INTRODUCTION Printed electronics is gaining traction in a number...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6579
... has been acquired under both twist and flex using resistance monitoring. Failure mechanisms have been studied for both deformation modes. polyimide substrate additive printing resistance aerosol jet printing failure reliability flexing twisting FLEXURE AND TWIST TEST RELIABILITY...