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Keywords: sintering analysis
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
... ink. The process parameter study includes printing parameters such as UAMFC, SMFC, stage speed, several passes, and sintering analysis, including sintering time and temperature. Print quality is evaluated using white light interferometry (WLI) and optical microscopy images. By integrating the bell...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
... and after the repair is compared for each of the passive components. Finally, a functional differentiator circuit is used to validate the findings. flexible printing substrates aerosol jet printing direct-write technique sustainable silver ink sintering analysis electrical resistance shear load...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
... parameters for microvias for multilayer z-axis interconnections. direct-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive low-temperature solder multilayer process development sintering analysis shear load to failure...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
... been studied. Mechanical and electrical properties also play an important role in the study of different sintering conditions. Optimized parameters from the printing process and sintering analysis are used to print and compare commercially available LC filter circuitry using the Bode plot. direct...