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Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
... width/line space of 1/1um and introduce the related process challenge, microstructure data. Keywords: FO-MCM, RDL, Warpage 1. INTRODUCTION For more than a decade, the semiconductor IC industry has developed with the evolution of the wafer manufacturing process. The number of transistors in a single chip...
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 27–29, 2020
Paper No: IPACK2020-2555
...THE SYSTEMATIC STUDY OF FAN-OUT WAFER WARPAGE USING ANALYTICAL, NUMERICAL AND EXPERIMENTAL METHODS Ghanshyam Gadhiya1*, Sven Rzepka1, Thomas Otto1 Fraunhofer ENAS, Micro Materials Center1 Chemnitz, Germany Sebastiaan Kersjes2, Felandorio Fernandes3 Besi Netherlands B.V.2 Amkor Technology Portugal...
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Paper No: IPACK2011-52260
..., and eliminate the need for a lid. Package warpage reduced a lot by adding a lid with the bare die FC package. However, the package and board level reliability for the above package types are still debatable. In this study test vehicles with three package types with bumps and BGAs are daisy chain to measure...
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 75-81, July 19–23, 2009
Paper No: InterPACK2009-89414
.... To guarantee the assembly yield and reliability of the solder joint between the top package and bottom package, mechanical compliance between these two packages is crucial during package stacking. Henceforth package warpage needs to be understood and controlled to meet the assembly yield targets...
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 533-540, July 8–12, 2007
Paper No: IPACK2007-33939
... 12 01 2010 Underfill is one of the crucial materials in flip chip (FC) packages. The role of underfill is not only to protect the solder bumps but to minimize package warpage, and to protect the fragile low k dielectric at end of line (EOL), moisture resistance test (MRT...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1187-1192, July 17–22, 2005
Paper No: IPACK2005-73184
... consisting of organic/composites (e.g. FR4) and circuit layers, laminated together. Such multi-layered structures exhibit ‘board warpage’ during manufacturing process. It is a result of residual thermo-mechanical stresses along with any asymmetries (if present) during the curing process. This effect further...
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 863-877, July 6–11, 2003
Paper No: IPACK2003-35296
... Proceedings of IPACK 03 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui, Hawaii, USA IPACK2003-35296 The Impact of Board Layout and Layup on PWB Warpage during fabrication and due to Reflow Solder Process: A Review of Literature...