In many industries, it is often required to transfer objects using compliant fingers capable of accommodating a limited range of object shapes/sizes without causing damage to the products being handled. This paper presents a coupled computational and experimental method in time domain to characterize the damping coefficient of a continuum structure, particularly, its applications for analyzing the damping effect of a highly damped compliant finger on contact-induced forces and stresses. With the aid of Rayleigh damping and explicit dynamic finite element analysis (FEA), this method relaxes several limitations of commonly used damping identification methods (such as log-decrement and half-power methods) that are valid for systems with an oscillatory response and generally estimate the damping ratio for a lumped parameter model. This damping identification method implemented using off-the-shelf commercial FEA packages has been validated by comparing results against published data; both oscillatory and nonoscillatory responses are considered. Along with a detailed discussion on practical issues commonly encountered in explicit dynamic FEA for damping identification, the effects of damping coefficients on contact between a rotating compliant finger and an elliptical object has been numerically investigated and experimentally validated. The findings offer a better understanding for improving grasper designs for applications where joint-less compliant fingers are advantageous.
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January 2012
Research Papers
Dynamic Modeling of Damping Effects in Highly Damped Compliant Fingers for Applications Involving Contacts
Chih-Hsing Liu,
Chih-Hsing Liu
Singapore Institute of Manufacturing Technology
, Singapore
638075
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Kok-Meng Lee
Kok-Meng Lee
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
, Atlanta, GA 30332 –0405
Search for other works by this author on:
Chih-Hsing Liu
Singapore Institute of Manufacturing Technology
, Singapore
638075
Kok-Meng Lee
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
, Atlanta, GA 30332 –0405 J. Dyn. Sys., Meas., Control. Jan 2012, 134(1): 011005 (9 pages)
Published Online: December 2, 2011
Article history
Received:
July 2, 2010
Revised:
July 31, 2011
Online:
December 2, 2011
Published:
December 2, 2011
Citation
Liu, C., and Lee, K. (December 2, 2011). "Dynamic Modeling of Damping Effects in Highly Damped Compliant Fingers for Applications Involving Contacts." ASME. J. Dyn. Sys., Meas., Control. January 2012; 134(1): 011005. https://doi.org/10.1115/1.4005270
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