Thermo-mechanical deformations of microstructures in a surface laminar circuit (SLC) substrate are quantified by microscopic moire´ interferometry. Two specimens are analyzed; a bare SLC substrate and a flip chip package assembly. The specimens are subjected to a uniform thermal loading of and the microscopic displacement fields are documented at the identical region of interest. The nano-scale displacement sensitivity and the microscopic spatial resolution obtained from the experiments provide a faithful account of the complex deformation of the surface laminar layer and the embedded microstructures. The displacement fields are analyzed to produce the deformed configuration of the surface laminar layer and the strain distributions in the microstructures. The high modulus of underfill produces a strong coupling between the chip and the surface laminar layer, which produces a DNP-dependent shear deformation of the layer. The effect of the underfill on the deformation of the microstructures is investigated and its implications on the package reliability are discussed. [S1043-7398(00)01304-9]
Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
Contributed by the Electrical and Electronic Packaging Division and presented at the 11th Symposium on Mechanics of Surface Mount Assembly, ASME International Mechanical Engineering Congress and Exposition, Nashville, TN, November 14–19, 1999. Revised manuscript received May 15, 2000. Associate Technical Editor: B. Courtois.
Han, B., and Kunthong, P. (May 15, 2000). "Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study ." ASME. J. Electron. Packag. December 2000; 122(4): 294–300. https://doi.org/10.1115/1.1290000
Download citation file: