This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles-to-failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of −30°C to 100°C, −55°C to 100°C, and −55°C to 125°C. Failure mechanisms, as well as cycles to failure for thermal shock and thermal cycling conditions in the range of −55°C to 125°C, were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented. [S1043-7398(00)00104-3]
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Revised manuscript received by the EEPD March 30, 2000. Associate Technical Editor: B. Coutrois.
Ghaffarian, R. (March 30, 2000). "Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies ." ASME. J. Electron. Packag. December 2000; 122(4): 335–340. https://doi.org/10.1115/1.1289627
Download citation file: