The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally-measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver computer code. For the case of the axisymmetric joint (zero shear) an exact solution to the capillary equations is also presented. The comparison of experimental and modeling results indicates that such models are accurate as well as extremely sensitive means for predicting the geometry of these solder joints.

Issue Section:
Technical Papers
Keywords:
flip-chip devices, reflow soldering, wetting, surface tension, deformation
Topics:
Displacement, Flip-chip, Modeling, Shear (Mechanics), Solder joints, Solders, Wetting, Geometry, Copper
1.
Johnson, C. D., and Baldwin, D. F., 1999, Proceedings of the 1999 Electronic Components and Technology Conference, 950.
2.
Johnson, C. D., Baldwin, D. F., 1999, International Symposium on Advanced Packaging Materials, 73.
3.
Brakke, K. A., Surface Evolver Manual, University of Minnesota Press. http://www.susqu.edu/facstaff/b/brakke/evolver/evolver.html.
4.
Moon
,
K. W.
,
Boettinger
,
W. J.
,
Williams
,
M. E.
,
Josell
,
D.
,
Murray
,
B. T.
,
Carter
,
W. C.
,
Handwerker
,
C. A.
,
1996
,
ASME J. Electron. Packag.
,
118
, p.
174
174
.
5.
Lee
,
Y. C.
, and
Basavanhally
,
N.
,
1994
,
J. Met.
,
46
, p.
46
46
.
6.
Deering
,
S. E.
, and
Szekely
,
J.
,
1994
,
J. Electron. Mater.
,
23
, p.
1325
1325
.
7.
Lin
,
W.
,
Patra
,
S. K.
, and
Lee
,
Y. C.
,
1995
,
IEEE Trans. Compon. Packag. Manuf. Technol., Part B
,
18
, p.
543
543
.
8.
Heinrich
,
S. M.
,
Schaefer
,
M.
,
Schroeder
,
S. A.
, and
Lee
,
P. S.
,
1996
,
ASME J. Electron. Packag.
,
118
, p.
114
114
.
9.
Lee
,
T. S.
,
Choi
,
T. P.
, and
Yoo
,
C. D.
,
1997
,
ASME J. Electron. Packag.
,
119
, p.
119
119
.
10.
Harsh
,
K. F.
,
Su
,
B.
,
Zhang
,
W.
,
Bright
,
V. M.
, and
Lee
,
Y. C.
,
2000
,
Sens. Actuators
,
80
, p.
108
108
.
11.
Syms
,
R. R. A.
,
1998
,
Sens. Actuators A
,
65
, p.
238
238
.
12.
Harsh
,
K. F.
,
Bright
,
V. M.
, and
Lee
,
Y. C.
,
1999
,
Sens. Actuators
,
77
, p.
237
237
.
13.
Landy, M., Patra, S. K., and Lee, Y. C., 1991, Manufacturing Processes and Materials Challenges in Microelectronic Packaging, AMD-131/EEP-1, 49.
14.
Park
,
J. Y.
,
Kang
,
C. S.
, and
Jung
,
J. P.
,
1999
,
J. Electron. Mater.
,
28
, p.
1256
1256
.
15.
van Veen
,
N.
,
1999
,
ASME J. Electron. Packag.
,
121
, p.
116
116
.
16.
Thompson, T. B. Subbarayan, G., James, R., and Renken, F. P., private communication.
17.
Amagai
,
M.
,
1999
,
Microelectronics Reliability
,
39
, p.
1365
1365
.
18.
Press, W. H., Flannery, B. P., Teukolsky, S. A., and Vetterling, W. T., 1988, Numerical Recipes in C, Cambridge University Press, 2nd edition.
19.
Josell
,
D.
,
1993
,
Acta Metall. Mater.
,
41
(
7
), p.
2179
2179
.
20.
Carter
,
W. C.
,
1988
,
Acta Metall.
,
36
, p.
2283
2283
.
21.
Silver
,
J.
,
Mi
,
Z. H.
,
Takamoto
,
K.
,
Bungay
,
P.
,
Brown
,
J.
, and
Powell
,
A.
,
1999
,
J. Colloid Interface Sci.
,
219
, p.
81
81
.
Copyright © 2002
 by ASME
You do not currently have access to this content.