Flip chip is the emerging interconnect technology for the next generation of high performance electronics. To eliminate the process bottlenecks associated with flip chip assembly, a new assembly technique based around “No-flow” underfill formulations has been proposed. In this paper, we have studied the correlation between the mechanical strength and the curing condition of no-flow flip chip assemblies using six different reflow profiles. It is found that both Ni3Sn4 and Cu6Sn5 intermetallics (IMCs) are formed at the solder/substrate pad and UBM (Under Bump Metallization)/solder interfaces respectively. The thickness of both IMCs increase with the increasing heating factor. The characteristics of the mechanical strength of these IMCs have been demonstrated. A correlation between the mechanical strength and the interfacial metallurgical reaction has been discussed. Also, the fastest possible reflow profile for both the cure of the underfill and maximizing the shear strength is identified. Based on the observed relationship of the mechanical strength and underfill curing of no-flow flip chip assemblies with Qn, the reflow profile should be controlled with caution in order to optimize both the mechanical strength and time for underfill cure. Only a clearer understanding of these correlation can allow manufacturers to develop a optimal, high reliable, low cost, high throughput no-flow flip chip assembly process.

Issue Section:
Additional Technical Papers
Keywords:
flip-chip devices, integrated circuit interconnections, encapsulation, integrated circuit packaging, plastic packaging, shear strength, heat treatment, interface structure, reflow soldering, surface chemistry
Topics:
Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials), Shear (Mechanics)
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