This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.
Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 2004. Associate Editor: Y. C. Lee.
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Guven, I., Kradinov , V., Tor , J. L., and Madenci, E. (October 6, 2004). "Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging ." ASME. J. Electron. Packag. September 2004; 126(3): 398–405. https://doi.org/10.1115/1.1773855
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