Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from . These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).
Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
Albany Nanotechnology Center,
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 4, 2014; final manuscript received April 22, 2015; published online July 14, 2015. Assoc. Editor: Gongnan Xie.
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McNamara, A. J., Joshi, Y., Zhang, Z., Moon, K., Lin, Z., Yao, Y., Wong, C., and Lin, W. (September 1, 2015). "Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials." ASME. J. Electron. Packag. September 2015; 137(3): 031014. https://doi.org/10.1115/1.4030802
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