A method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy-based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10-μm thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m2.
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December 2017
Research-Article
Determination of Energy Release Rate Through Sequential Crack Extension
Scott McCann,
Scott McCann
George W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: mccann.scott.r@gmail.com
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: mccann.scott.r@gmail.com
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Gregory T. Ostrowicki,
Gregory T. Ostrowicki
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: gtostrowicki@ti.com
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: gtostrowicki@ti.com
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Anh Tran,
Anh Tran
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: anh.vt2@gatech.edu
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: anh.vt2@gatech.edu
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Timothy Huang,
Timothy Huang
3D Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: tim.huang@gatech.edu
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: tim.huang@gatech.edu
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Rao R. Tummala,
Rao R. Tummala
3D Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rtummala@ece.gatech.edu
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rtummala@ece.gatech.edu
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Suresh K. Sitaraman
Suresh K. Sitaraman
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: Suresh.sitaraman@me.gatech.edu
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: Suresh.sitaraman@me.gatech.edu
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Scott McCann
George W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: mccann.scott.r@gmail.com
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: mccann.scott.r@gmail.com
Gregory T. Ostrowicki
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: gtostrowicki@ti.com
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: gtostrowicki@ti.com
Anh Tran
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: anh.vt2@gatech.edu
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: anh.vt2@gatech.edu
Timothy Huang
3D Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: tim.huang@gatech.edu
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: tim.huang@gatech.edu
Tobias Bernhard
Rao R. Tummala
3D Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rtummala@ece.gatech.edu
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rtummala@ece.gatech.edu
Suresh K. Sitaraman
George W. Woodruff School of
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: Suresh.sitaraman@me.gatech.edu
Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: Suresh.sitaraman@me.gatech.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 22, 2017; final manuscript received June 4, 2017; published online August 25, 2017. Assoc. Editor: Eric Wong.
J. Electron. Packag. Dec 2017, 139(4): 041003 (9 pages)
Published Online: August 25, 2017
Article history
Received:
March 22, 2017
Revised:
June 4, 2017
Citation
McCann, S., Ostrowicki, G. T., Tran, A., Huang, T., Bernhard, T., Tummala, R. R., and Sitaraman, S. K. (August 25, 2017). "Determination of Energy Release Rate Through Sequential Crack Extension." ASME. J. Electron. Packag. December 2017; 139(4): 041003. https://doi.org/10.1115/1.4037334
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