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Issues
June 2014
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
J. Electron. Packag. June 2014, 136(2): 020301.
doi: https://doi.org/10.1115/1.4027498
Research Papers
Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and Obstacles
J. Electron. Packag. June 2014, 136(2): 021001.
doi: https://doi.org/10.1115/1.4025757
Topics:
Flow (Dynamics)
,
Heat transfer
,
Microchannels
,
Water
,
Cooling
,
Performance evaluation
Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach
J. Electron. Packag. June 2014, 136(2): 021002.
doi: https://doi.org/10.1115/1.4027174
Topics:
Cooling
,
Design
,
Microchannels
,
Cooling systems
Thermal Management of Time-Varying High Heat Flux Electronic Devices
J. Electron. Packag. June 2014, 136(2): 021003.
doi: https://doi.org/10.1115/1.4027325
Topics:
Flow (Dynamics)
,
Heat flux
,
Heat sinks
,
Microchannels
,
Temperature
,
Fluids
,
Steady state
,
Vapors
,
Wall temperature
,
Boiling
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
J. Electron. Packag. June 2014, 136(2): 021004.
doi: https://doi.org/10.1115/1.4027338
Topics:
Design
,
Dimensions
,
Heat sinks
,
Heat transfer
,
Ducts
,
Microchannels
,
Cooling
An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions
J. Electron. Packag. June 2014, 136(2): 021005.
doi: https://doi.org/10.1115/1.4025713
Topics:
Flow (Dynamics)
,
Fluids
,
Heat transfer
,
Non-Newtonian fluids
,
Viscosity
,
Friction
,
Shear (Mechanics)
Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
J. Electron. Packag. June 2014, 136(2): 021006.
doi: https://doi.org/10.1115/1.4027436
Topics:
Flow (Dynamics)
,
Heat
,
Stress
,
Vapors
,
Heat flux
,
Temperature
,
Heat transfer
Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits
J. Electron. Packag. June 2014, 136(2): 021007.
doi: https://doi.org/10.1115/1.4027091
Topics:
Density
,
Flow (Dynamics)
,
Pressure drop
,
Temperature
,
Cooling
,
Fins
Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
J. Electron. Packag. June 2014, 136(2): 021008.
doi: https://doi.org/10.1115/1.4027420
Topics:
Boiling
,
Cooling
,
Flow (Dynamics)
,
Heat flux
,
Heat transfer
,
Microchannels
,
Modeling
,
Porous materials
,
Pressure drop
,
Temperature
Technology Review
Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
J. Electron. Packag. June 2014, 136(2): 024001.
doi: https://doi.org/10.1115/1.4027175
Topics:
Cooling
,
Cooling systems
,
Design
,
Flow (Dynamics)
,
Heat
,
Microchannels
,
Pressure drop
,
Computer cooling
,
Temperature
,
Coolants
Advances in the Fabrication Processes and Applications of Wafer Level Packaging
J. Electron. Packag. June 2014, 136(2): 024002.
doi: https://doi.org/10.1115/1.4027397
Topics:
Manufacturing
,
Packaging
,
Reliability
,
Semiconductor wafers
,
Microelectromechanical systems
,
Solders
,
Solder joints
,
Copper
,
Polymers
Technical Brief
Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
J. Electron. Packag. June 2014, 136(2): 024501.
doi: https://doi.org/10.1115/1.4026538
Topics:
Cooling
,
Heat
,
Heat sinks
,
Strips
,
Temperature
,
Thermal analysis
,
Thermal resistance
,
Electrical conductance
,
Invar
,
Temperature distribution
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