Topics: Computer cooling , Cooling , Heat pipes , Nanofluids , Phase change materials , Water , Temperature , Paraffin wax , Heating , Test facilities

A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics

Mehmet Arik, Yogen V. Utturkar

J. Electron. Packag. June 2015, 137(2): 021005. doi: https://doi.org/10.1115/1.4029067

Abstract

View articletitled, A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics

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Topics: Computational fluid dynamics , Cooling , Dipoles (Electromagnetism) , Electronics , Flow (Dynamics) , Heat transfer , Jets , Vortices

Study of Electromigration-Induced Stress of Solder

Fei Su, Zheng Zhang, Yuan Wang, Weijia Li

J. Electron. Packag. June 2015, 137(2): 021006. doi: https://doi.org/10.1115/1.4029463

Abstract

View articletitled, Study of Electromigration-Induced Stress of Solder

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Topics: Deformation , Electrodiffusion , Finite element methods , Solders , Stress

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

Tianyi Gao, Bahgat Sammakia, Emad Samadiani, Roger Schmidt

J. Electron. Packag. June 2015, 137(2): 021007. doi: https://doi.org/10.1115/1.4029163

Abstract

View articletitled, Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

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Topics: Cooling , Data centers , Doors , Failure , Heat exchangers , Steady state , Temperature , Water , Cooling systems , Air flow

Thermal Cycling Study of Quilt Packaging

M. Ashraf Khan, Quanling Zheng, David Kopp, Wayne Buckhanan, Jason M. Kulick, Patrick Fay, Alfred M. Kriman, Gary H. Bernstein

J. Electron. Packag. June 2015, 137(2): 021008. doi: https://doi.org/10.1115/1.4029245

Abstract

View articletitled, Thermal Cycling Study of Quilt Packaging

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Topics: Cycles , Packaging , Quadratic programming , Solders , Testing , Stress , Copper , Failure , Reliability , Tin

Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

Naveenan Thiagarajan, Sushil H. Bhavnani, Vinod Narayanan

J. Electron. Packag. June 2015, 137(2): 021009. doi: https://doi.org/10.1115/1.4029246

Abstract

View articletitled, Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

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Topics: Bubbles , Vapors , Liquid films , Fluids , Pool boiling

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava

J. Electron. Packag. June 2015, 137(2): 021010. doi: https://doi.org/10.1115/1.4029344

Abstract

View articletitled, Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

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Topics: Air flow , Calibration , Computational fluid dynamics , Containment , Data centers , Flow (Dynamics) , Leakage , Stress , Temperature , Tiles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen

J. Electron. Packag. June 2015, 137(2): 021011. doi: https://doi.org/10.1115/1.4029345

Abstract

View articletitled, Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

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Topics: Electron mobility , Solders , Stress , Thermal stresses , Intermetallic compounds , Deformation

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012. doi: https://doi.org/10.1115/1.4029441

Abstract

View articletitled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

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Topics: Cycles , Damage , Displacement , Fatigue , Fracture (Materials) , Lead-free solders , Solders , Stiffness , Stress , Temperature

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang

J. Electron. Packag. June 2015, 137(2): 021013. doi: https://doi.org/10.1115/1.4029569

Abstract

View articletitled, Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

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Topics: Heat transfer , Optimization , Solders , Strips , Reflow soldering

Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow

S. S. Feng, J. J. Kuang, T. J. Lu, K. Ichimiya

J. Electron. Packag. June 2015, 137(2): 021014. doi: https://doi.org/10.1115/1.4029722

Abstract

View articletitled, Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Metal foams , Pressure drop

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A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics

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Thermal Cycling Study of Quilt Packaging

Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

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