Volume 137 Issue 3 | J. Electron. Packag.

Skip Nav Destination

Volume 137, Issue 3

September 2015

ISSN 1043-7398

EISSN 1528-9044

Research Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

J. Electron. Packag. September 2015, 137(3): 031001. doi: https://doi.org/10.1115/1.4029931

Abstract

View articletitled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Open the PDF for in another window

Topics: Annealing , Copper , Grain boundaries , Thin films , Electrical properties , Electron backscatter diffraction

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

J. Electron. Packag. September 2015, 137(3): 031002. doi: https://doi.org/10.1115/1.4029835

Abstract

View articletitled, Multiscale Transient Thermal Analysis of Microelectronics

Open the PDF for in another window

Topics: Microelectronic devices , Modeling , Simulation , Temperature , Thermal analysis , Transients (Dynamics) , Temperature distribution

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Abas Abdoli, George S. Dulikravich, Genesis Vasquez, Siavash Rastkar

J. Electron. Packag. September 2015, 137(3): 031003. doi: https://doi.org/10.1115/1.4030005

Abstract

View articletitled, Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Open the PDF for in another window

Topics: Cooling , Design , Microchannels , Stress , Heat flux , Deformation , Fluids , Heat transfer , Temperature , Heat

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

David A. Roberson, Ryan B. Wicker, Eric MacDonald

J. Electron. Packag. September 2015, 137(3): 031004. doi: https://doi.org/10.1115/1.4030286

Abstract

View articletitled, Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Open the PDF for in another window

Topics: Electronics , Hardening (Curing) , Inks , Temperature , Additive manufacturing , Silver , Manufacturing , Damage

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui

J. Electron. Packag. September 2015, 137(3): 031005. doi: https://doi.org/10.1115/1.4029836

Abstract

View articletitled, Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Open the PDF for in another window

Topics: Alloys , Mechanical properties , Nanoindentation , Temperature , Tin , Young's modulus , Lead-free solders

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman

J. Electron. Packag. September 2015, 137(3): 031006. doi: https://doi.org/10.1115/1.4030065

Abstract

View articletitled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

Open the PDF for in another window

Topics: Dimensions , Electrical resistance , Fatigue life , Manufacturing , Solders , Stress , Warping , Cycles , Signals , Thermomechanics

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang

J. Electron. Packag. September 2015, 137(3): 031007. doi: https://doi.org/10.1115/1.4030392

Abstract

View articletitled, Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Open the PDF for in another window

Topics: Cycles , Glass transition , Reliability , Solders , Stress , Temperature , Numerical analysis , Failure , Tin , Failure mechanisms

Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

C. D. Smoot, A. A. Hathaway, H. B. Ma, M. T. Crawford, B. M. Huhman, Annie Sobel

J. Electron. Packag. September 2015, 137(3): 031008. doi: https://doi.org/10.1115/1.4030642

Abstract

View articletitled, Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

Open the PDF for in another window

Topics: Copper , Heat , Heat pipes , Heating , Magnetic fields , Rails , Temperature , Transients (Dynamics) , Fluids

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou

J. Electron. Packag. September 2015, 137(3): 031009. doi: https://doi.org/10.1115/1.4030643

Abstract

View articletitled, Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Open the PDF for in another window

Topics: Cooling , Flow (Dynamics) , Heat , Manufacturing , Microchannels , Microfluidics , Resistors , Temperature , Thermal resistance , Water

Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Soochan Lee, Patrick E. Phelan, Carole-Jean Wu

J. Electron. Packag. September 2015, 137(3): 031010. doi: https://doi.org/10.1115/1.4030686

Abstract

View articletitled, Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Open the PDF for in another window

Topics: Cooling , Energy generation , Temperature , Thermoelectric coolers , Waste heat , Heat , Reliability , Electronic packaging

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown

J. Electron. Packag. September 2015, 137(3): 031011. doi: https://doi.org/10.1115/1.4030685

Abstract

View articletitled, Simulation of Secondary Contact to Generate Very High Accelerations

Open the PDF for in another window

Topics: Damping , Elastomers , Finite element analysis , Simulation , Springs , Stiffness , Modeling , Manufacturing , Clearances (Engineering)

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

K.-C. Liao, H.-L. Lu

J. Electron. Packag. September 2015, 137(3): 031012. doi: https://doi.org/10.1115/1.4030803

Abstract

View articletitled, Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Open the PDF for in another window

Topics: Computer simulation , Molten salt reactors , Temperature , Temperature distribution

Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

Weihuan Zhao, David M. France, Wenhua Yu, Dileep Singh

J. Electron. Packag. September 2015, 137(3): 031013. doi: https://doi.org/10.1115/1.4030896

Abstract

View articletitled, Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

Open the PDF for in another window

Topics: Boiling , Coolants , Cooling , Electronics , Subcooling , Temperature , Heat flux

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang, Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong, Wei Lin

J. Electron. Packag. September 2015, 137(3): 031014. doi: https://doi.org/10.1115/1.4030802

Abstract

View articletitled, Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Open the PDF for in another window

Topics: Carbon nanotubes , Steady state , Temperature , Thermal resistance , Solders , Thermal conductivity

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

J. Electron. Packag. September 2015, 137(3): 031015. doi: https://doi.org/10.1115/1.4030953

Abstract

View articletitled, Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

Open the PDF for in another window

Topics: Flow (Dynamics) , Fluids , Heat transfer , Heat transfer coefficients , Nozzles , Reynolds number , Jets , Temperature , Heat flux

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai

J. Electron. Packag. September 2015, 137(3): 031016. doi: https://doi.org/10.1115/1.4030974

Abstract

View articletitled, Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Open the PDF for in another window

Topics: Ferronickel , Finite element analysis , Reliability , Semiconductor wafers , Solders , Temperature , Fracture (Materials) , Failure mechanisms , Alloys , Stress

Review Article

Reviewers Acknowledgment for the Journal of Electronic Packaging

J. Electron. Packag. September 2015, 137(3): 038001. doi: https://doi.org/10.1115/1.4030195

Extract

View articletitled, Reviewers Acknowledgment for the Journal of Electronic Packaging

Open the PDF for in another window

Topics: Electronic packaging

Research Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Multiscale Transient Thermal Analysis of Microelectronics

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Simulation of Secondary Contact to Generate Very High Accelerations

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Review Article

Reviewers Acknowledgment for the Journal of Electronic Packaging

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Research Papers

Review Article

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only