Topics: Batteries , Density , Electronic packaging , Microelectromechanical systems , Optoelectronic devices , Packaging , Semiconductor wafers , Sensors , Reliability

Special Section Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

J. Electron. Packag. June 2018, 140(2): 020901. doi: https://doi.org/10.1115/1.4039136

Abstract

View articletitled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

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Topics: Elastic moduli , Network models , Particulate matter , Stiffness , Fillers (Materials) , Particle size , Mechanical properties

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

J. Electron. Packag. June 2018, 140(2): 020902. doi: https://doi.org/10.1115/1.4039137

Abstract

View articletitled, Failure Analysis of Direct Liquid Cooling System in Data Centers

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Topics: Cooling systems , Data centers , Failure , Temperature , Cooling , Flow (Dynamics) , Coolants

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

J. Electron. Packag. June 2018, 140(2): 020903. doi: https://doi.org/10.1115/1.4039265

Abstract

View articletitled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

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Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra

J. Electron. Packag. June 2018, 140(2): 020904. doi: https://doi.org/10.1115/1.4039138

Abstract

View articletitled, Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

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Topics: Sensors

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

J. Electron. Packag. June 2018, 140(2): 020905. doi: https://doi.org/10.1115/1.4039301

Abstract

View articletitled, Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

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Topics: Damage , Electronics , Engineering standards , Failure , Failure mechanisms , Reliability , Solder joints , Vibration , Transportation systems , Fatigue

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 020906. doi: https://doi.org/10.1115/1.4040088

Abstract

View articletitled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals

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Topics: Copper , Critical heat flux , Heat transfer , Pool boiling , Boiling , Heat transfer coefficients , Bubbles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

J. Electron. Packag. June 2018, 140(2): 020907. doi: https://doi.org/10.1115/1.4039974

Abstract

View articletitled, Challenges in Three-Dimensional Printing of High-Conductivity Copper

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Topics: Copper , Copper powders , Lasers , Porosity , Electrical conductivity , Additive manufacturing , Density , Modeling , Thermal conductivity

Research Papers

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 021001. doi: https://doi.org/10.1115/1.4039475

Abstract

View articletitled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

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Topics: Fins , Flow (Dynamics) , Fluids , Friction , Heat transfer , Pressure drop , Reynolds number , Water , Heat , Temperature

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome

J. Electron. Packag. June 2018, 140(2): 021002. doi: https://doi.org/10.1115/1.4039706

Abstract

View articletitled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

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Topics: Flow (Dynamics) , Fluids , Heat , Refrigerants , Condensers (steam plant) , Stress , Cooling systems , Temperature , Design , Natural convection