Topics: Design , Hinges , Printed circuit boards , Stiffness , Stress , Deflection , Finite element analysis , Engineering prototypes , Materials properties

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang

J. Electron. Packag. December 2018, 140(4): 041002. doi: https://doi.org/10.1115/1.4040670

Abstract

View articletitled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

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Topics: Density , Design , Heat , Modeling , Optimization , Silicon , Temperature , Simulation , Energy dissipation , Gates (Closures)

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar

J. Electron. Packag. December 2018, 140(4): 041003. doi: https://doi.org/10.1115/1.4040924

Abstract

View articletitled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

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Topics: Failure , Finite element analysis , Modeling , Reliability , Solders , Thermomechanics , Lead-free solders , Electronic packaging , Uncertainty , Stress

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004. doi: https://doi.org/10.1115/1.4040923

Abstract

View articletitled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

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Topics: Deflection , Failure , Failure analysis , Finite element analysis , Finite element model , Manufacturing , Reliability , Resonance , Solder joints , Solders

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu

J. Electron. Packag. December 2018, 140(4): 041005. doi: https://doi.org/10.1115/1.4041064

Abstract

View articletitled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

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Topics: Ball-Grid-Array packaging , Electromagnetic scattering , Materials properties , Radiation scattering , Scattering (Physics) , Temperature , Thermal expansion , Warping , Simulation , Laminates

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch

J. Electron. Packag. December 2018, 140(4): 041006. doi: https://doi.org/10.1115/1.4040978

Abstract

View articletitled, Reactive Joining of Thermally and Mechanically Sensitive Materials

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Topics: Borosilicate glasses , Joining , Solders , Soldering , Tin , Aluminum , Heat , Temperature , Glass , Thermal shock

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen

J. Electron. Packag. December 2018, 140(4): 041007. doi: https://doi.org/10.1115/1.4041014

Abstract

View articletitled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

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Topics: Dimensional analysis , Electrical properties , Finite element analysis , Flexible electronics , Inks , Modeling , Plasticity , Silver , Simulation , Stress