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Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes
Journal Articles

A Shape Optimal Design Methodology for Packaging Design

S. D. Rajan, Ben Nagaraj, Mali Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 461–466.
https://doi.org/10.1115/1.2905481
Published Online: December 1, 1992
View Article titled, A Shape Optimal Design Methodology for Packaging Design
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Topics: Design, Design methodology, Packaging, Shapes, Nonlinear programming, Aerospace industry, Electronic packaging, Finite element analysis